Details

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BUY TLP550G https://www.utsource.net/itm/p/5300962.html

Parameter	Symbol	Min	Typ	Max	Unit	Conditions
Forward Voltage (LED)	VF	1.2	1.4	1.6	V	IF = 20 mA
Reverse Voltage (LED)	VR	-5	-	-5	V	IR ≤ 1 μA
Forward Current (LED)	IF	-	20	50	mA	Continuous
Peak Forward Current (LED)	IF(PK)	-	-	150	mA	tP = 1 ms, Duty Cycle = 1%
Storage Temperature	TSTG	-40	-	125	°C	-
Operating Temperature	TA	-40	-	85	°C	-
Isolation Voltage	VIORM	-	5000	-	Vrms	1 min, 50/60 Hz
Collector-Emitter Breakdown Voltage	V(BR)CEO	-	-	70	V	IC = 50 mA, TA = 25°C
Collector-Emitter Saturation Voltage	VCE(SAT)	0.3	0.5	0.7	V	IC = 100 mA, IF = 20 mA, TA = 25°C
Collector Current	IC	-	100	150	mA	VCE = 5 V, IF = 20 mA
Turn-On Time	ton	-	1	3	μs	VCC = 5 V, RL = 100 Ω, IF = 20 mA
Turn-Off Time	toff	-	1	3	μs	VCC = 5 V, RL = 100 Ω, IF = 20 mA

Instructions for Using TLP550G:

1. Power Supply:

   • Ensure that the supply voltage (V_CC) is within the operating range of 4.5 V to 5.5 V.
   • Connect the power supply to the V_CC and GND pins.

2. Input Signal:

   • Apply the input signal to the LED (anode and cathode).
   • The forward current (I_F) should be set to 20 mA for optimal performance.
   • Use a current-limiting resistor to prevent exceeding the maximum forward current of 50 mA.

3. Output Signal:

   • Connect the load between the collector and the power supply.
   • The emitter should be connected to ground.
   • Ensure the load resistance (R_L) is appropriate for the collector current (I_C).

4. Temperature Considerations:

   • Operate the device within the temperature range of -40°C to 85°C.
   • Avoid exceeding the storage temperature range of -40°C to 125°C.

5. Isolation:

   • The device provides galvanic isolation up to 5000 Vrms for 1 minute at 50/60 Hz.
   • Ensure proper insulation and spacing to maintain this isolation.

6. Timing:

   • The turn-on and turn-off times are typically 1 μs to 3 μs. Ensure that the circuit design accounts for these delays.

7. Handling:

   • Handle the device with care to avoid damage.
   • Follow ESD (Electrostatic Discharge) precautions to prevent damage to the device.

8. Mounting:

   • Mount the device on a PCB with proper thermal management if high power dissipation is expected.
   • Ensure good mechanical stability and avoid excessive mechanical stress on the leads.

(For reference only)