Details

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BUY TNY284DG https://www.utsource.net/itm/p/5321070.html
Analog Circuit, 1 Func, PDSO7, SO-8/7

Parameter	Symbol	Min	Typ	Max	Unit	Description
Input Voltage	VIN	70	-	375	V	Operating input voltage range
Output Voltage	VOUT	-	5	-	V	Regulated output voltage (fixed)
Output Current	IOUT	-	1	-	A	Maximum continuous output current
Quiescent Current	IQ	-	0.5	-	mA	Supply current during operation
Shutdown Current	ISD	-	0.05	-	μA	Supply current in shutdown mode
Switching Frequency	fSW	-	65	-	kHz	Nominal switching frequency
Duty Cycle	D	-	0.5	-	-	Typical duty cycle
Thermal Shutdown Temperature	TJ(MAX)	-	150	-	°C	Maximum junction temperature for thermal shutdown
Storage Temperature Range	TSTG	-40	-	85	°C	Temperature range for storage
Operating Temperature Range	TOPR	-40	-	85	°C	Temperature range for operation

Instructions for Using TNY284DG

1. Input Connection:

   • Connect the input voltage (VIN) to the high-voltage input pin.
   • Ensure the input voltage is within the specified range (70V to 375V).

2. Output Configuration:

   • The TNY284DG provides a fixed output voltage of 5V.
   • Connect the output load between the output pin and ground.

3. Thermal Management:

   • Place the device on a heatsink or ensure adequate airflow to prevent the junction temperature from exceeding 150°C.
   • Monitor the operating temperature to avoid overheating.

4. Shutdown Mode:

   • To enter shutdown mode, pull the shutdown pin low.
   • The device will draw a minimal current (0.05 μA) in this mode.

5. Capacitor Selection:

   • Use appropriate input and output capacitors to filter noise and stabilize the voltage.
   • Input capacitors should be rated for the maximum input voltage and have low ESR.
   • Output capacitors should be selected based on the load requirements and ripple specifications.

6. Inductor Selection:

   • Choose an inductor with a saturation current higher than the maximum output current (1A).
   • Ensure the inductor has low DC resistance to minimize power loss.

7. PCB Layout:

   • Keep the layout compact to reduce parasitic inductance and capacitance.
   • Place high-frequency components close to the IC to minimize noise.

8. Protection Circuits:

   • Implement overvoltage protection (OVP) and overcurrent protection (OCP) circuits to safeguard the device and connected components.
   • Use TVS diodes to protect against voltage transients.

9. Testing and Validation:

   • Test the circuit under various load conditions to ensure stable operation.
   • Verify that the output voltage remains within the specified tolerance.

10. Compliance:

    • Ensure the design complies with relevant safety and regulatory standards.
    • Perform EMC/EMI testing to meet required emission and immunity levels.

(For reference only)