XC3S50A-4VQG100C

XC3S50A-4VQG100C


Specifications
SKU
5396308
Details

BUY XC3S50A-4VQG100C https://www.utsource.net/itm/p/5396308.html
FPGA SPARTAN-3A 50K 100-VQFP
Parameter Description
Device XC3S50A-4VQG100C
Family Spartan-3A
Package VQG100 (14x14mm)
Speed Grade -4 (Maximum Frequency: 286 MHz)
I/O Banks 16
Configuration Memory 2,736 bits
User I/Os 76
Internal Oscillator No
Dedicated Clock Inputs 2
Dedicated JTAG Pins 4 (TCK, TMS, TDI, TDO)
Power Supply VCCO: 1.2V to 3.3V, VCCAUX: 1.2V, VCCINT: 1.2V
Operating Temperature Range -40°C to +85°C
Configuration Modes Master, Slave, BPI, SPI, JTAG, Boundary Scan
Configuration File Size 1.9 Mbits
Configuration Time < 10 ms ( typical )
Programming Method In-System Programming (ISP) via JTAG or Boundary Scan
Special Features DCM (Digital Clock Manager), Block RAM, Multipliers, Dedicated I/O Standards Support

Instructions for Use:

  1. Power Supply Connections:

    • Connect VCCO to the appropriate voltage (1.2V to 3.3V) based on your I/O standard.
    • Connect VCCAUX to 1.2V.
    • Connect VCCINT to 1.2V.
    • Ensure all power supply pins have adequate decoupling capacitors close to the device.
  2. Configuration:

    • Use the Xilinx ISE Design Suite to generate the configuration bitstream.
    • Program the device using JTAG, BPI, or SPI modes as per your design requirements.
    • For in-system programming, ensure the JTAG chain is correctly set up and the boundary scan is functional.
  3. Clock Management:

    • Utilize the Digital Clock Manager (DCM) for clock synthesis and phase shifting.
    • Connect dedicated clock inputs to your external clock sources.
  4. I/O Standards:

    • Configure I/O banks to support the required standards (e.g., LVCMOS, LVTTL, SSTL).
    • Refer to the Xilinx datasheets for specific I/O standard voltage levels and timing requirements.
  5. Testing and Debugging:

    • Use JTAG for boundary scan testing and debugging.
    • Verify the configuration and functionality using test vectors and simulation models.
  6. Thermal Considerations:

    • Ensure proper thermal management by providing adequate heat dissipation, especially for high-frequency applications.
    • Monitor the junction temperature to stay within the specified operating range.
  7. Documentation:

    • Refer to the Xilinx Spartan-3A Data Sheet and User Guides for detailed information on device capabilities, pinout, and application notes.
(For reference only)

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