Details

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BUY FAN7930CMX https://www.utsource.net/itm/p/5439755.html
CrCM PFC Controller, PFC-Ready Signal, 8LD, SOIC, JEDEC MS-012, 150 quot; NARROW BODY, 2500/TAPE REEL

Parameter	Symbol	Min	Typ	Max	Unit	Conditions
Supply Voltage	VCC	4.5	5	5.5	V
Quiescent Current	IQ	-	1.2	-	mA	VCC = 5V, No Load
Output Voltage (High)	VOH	4.5	-	5	V	VCC = 5V, IOL = 0mA
Output Voltage (Low)	VOL	0	-	0.4	V	VCC = 5V, IOH = 0mA
Output Current (Sink)	IOL	20	-	30	mA	VCC = 5V, VOL = 0.4V
Output Current (Source)	IOH	-20	-	-30	mA	VCC = 5V, VOH = 4.5V
Input High Level Voltage	VIH	3.5	-	5.5	V
Input Low Level Voltage	VIL	0	-	1.5	V
Propagation Delay Time	tpd	-	10	-	ns	VCC = 5V, RL = 15pF
Operating Temperature Range	TOPR	-40	-	85	°C
Storage Temperature Range	TSTG	-65	-	150	°C

Instructions for Use:

1. Power Supply:

   • Ensure the supply voltage (VCC) is within the specified range of 4.5V to 5.5V.
   • Use a stable power source to avoid voltage fluctuations that could affect performance.

2. Quiescent Current:

   • The quiescent current is typically 1.2mA when no load is connected. This should be considered in power budget calculations.

3. Output Voltage Levels:

   • When the output is high, the voltage (VOH) should be between 4.5V and 5V.
   • When the output is low, the voltage (VOL) should be between 0V and 0.4V.

4. Output Current:

   • The device can sink up to 30mA and source up to 30mA.
   • Ensure that the load does not exceed these limits to prevent damage to the device.

5. Input Voltage Levels:

   • The input high level voltage (VIH) should be at least 3.5V.
   • The input low level voltage (VIL) should be no more than 1.5V.

6. Propagation Delay:

   • The typical propagation delay time (tpd) is 10ns. This is important for timing considerations in your circuit.

7. Temperature Ranges:

   • The operating temperature range (TOPR) is from -40°C to 85°C.
   • The storage temperature range (TSTG) is from -65°C to 150°C. Store the device in a suitable environment to ensure longevity.

8. Handling:

   • Handle the device with care to avoid static damage. Use appropriate ESD protection measures.
   • Follow recommended soldering profiles to prevent thermal stress during assembly.

9. Layout Considerations:

   • Keep signal traces short and direct to minimize noise and improve signal integrity.
   • Use bypass capacitors close to the power pins to filter out any supply noise.

10. Testing:

    • Before finalizing the design, test the device under various conditions to ensure it meets the required specifications and performance criteria.

(For reference only)