BSM300GA120DN2FS_E3256

BSM300GA120DN2FS_E3256

Category: Modules

Specifications
Details

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Parameter Description Value Unit
Part Number Full part number BSM300GA120DN2FS_E3256 -
Type Device type IGBT Module -
Voltage Rating (Vces) Collector-Emitter Breakdown Voltage 1200 V
Current Rating (Ic) Continuous Collector Current 300 A
Switching Frequency Maximum switching frequency 15 kHz
Power Dissipation Maximum power dissipation 4000 W
Operating Temperature Junction temperature range -40 to 150 °C
Package Module package type D2PAK -
Pin Configuration Pin configuration G: Gate, C: Collector, E: Emitter -

Instructions for Use:

  1. Installation:

    • Ensure the module is mounted on a suitable heat sink to manage thermal performance.
    • Follow proper torque specifications for mounting screws to avoid damage.
  2. Electrical Connections:

    • Connect the gate (G), collector (C), and emitter (E) terminals as per your circuit design.
    • Ensure all connections are secure and insulated to prevent short circuits.
  3. Thermal Management:

    • Maintain the operating temperature within the specified range to ensure reliable operation.
    • Use thermal grease or pads between the module and heat sink for optimal heat transfer.
  4. Driving the Gate:

    • Use a gate driver IC that can provide sufficient drive current and voltage for fast switching.
    • Keep gate resistance low to minimize switching losses.
  5. Protective Measures:

    • Incorporate overcurrent and overtemperature protection in your design.
    • Consider using snubber circuits if high dv/dt conditions are expected.
  6. Handling Precautions:

    • Handle the module with care to avoid mechanical damage.
    • Avoid exposure to moisture and corrosive environments.
  7. Storage:

    • Store in a dry, cool place away from direct sunlight.
    • Follow anti-static precautions during storage and handling.
(For reference only)

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