Details

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BUY DS1225AD-85IND+ https://www.utsource.net/itm/p/5655081.html

Parameter	Symbol	Min	Typ	Max	Unit
Operating Voltage	Vcc	4.75		5.25	V
Output Current	Iout		100		mA
Dropout Voltage	Vdo		0.3		V
Quiescent Current	Iq		2.5		mA
Line Regulation			0.01		%/V
Load Regulation			0.01		%/mA
Thermal Shutdown	TSD		160		掳C
Operating Temperature	Topr	-40		85	掳C
Storage Temperature	Tstg	-65		150	掳C

Instructions for DS1225AD-85IND+

1. Power Supply:

   • Ensure the input voltage (Vcc) is within the range of 4.75V to 5.25V.
   • Connect the input voltage to the Vcc pin and ground to the GND pin.

2. Output Configuration:

   • The output current (Iout) can be up to 100mA. Ensure that the load does not exceed this limit to avoid damage to the device.
   • Connect the load to the Vout pin and ground to the GND pin.

3. Thermal Management:

   • The device has a thermal shutdown feature that activates at approximately 160掳C. Ensure proper heat dissipation to prevent overheating.
   • Use a heatsink if the device will be operating near its maximum temperature limits.

4. Regulation:

   • The line regulation is 0.01% per volt, and the load regulation is 0.01% per milliamp. These parameters ensure stable output voltage under varying input conditions and load currents.

5. Operating Temperature:

   • The device is designed to operate within the temperature range of -40掳C to 85掳C. Avoid operating the device outside this range to ensure reliable performance.

6. Storage Temperature:

   • Store the device in an environment with temperatures between -65掳C and 150掳C to maintain its integrity.

7. Quiescent Current:

   • The quiescent current (Iq) is typically 2.5mA. This is the current consumed by the device when it is not supplying any load.

8. Dropout Voltage:

   • The dropout voltage (Vdo) is typically 0.3V. This is the minimum difference between the input and output voltages required for the regulator to maintain regulation.

9. Handling:

   • Handle the device with care to avoid static discharge, which can damage the internal components.
   • Follow standard ESD (Electrostatic Discharge) precautions when handling the device.

10. Mounting:

    • Mount the device on a PCB using standard surface mount technology (SMT) techniques.
    • Ensure all connections are secure and free from solder bridges or shorts.

11. Testing:

    • After assembly, test the device to ensure it meets the specified electrical parameters.
    • Verify the output voltage and current under different load conditions to confirm proper operation.

(For reference only)