TOP269EG

TOP269EG

Category: IC Chips

Specifications
SKU
5773255
Details

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Integrated Off-Line Switcher with EcoSmart Technology for Highly Efficient Power Supplies
Parameter Symbol Min Typ Max Unit Description
Input Voltage VIN 180 - 375 V Operating input voltage range
Output Voltage VOUT - 5 - V Nominal output voltage (fixed)
Output Current IOUT - 1.5 - A Maximum continuous output current
Efficiency η - 85 - % Typical efficiency at nominal load conditions
Switching Frequency fSW - 132 - kHz Fixed switching frequency
Power Dissipation PD - 1.5 - W Maximum power dissipation at full load
Thermal Resistance (θJA) - - 50 - °C/W Junction-to-ambient thermal resistance
Operating Temperature TOP -40 - 125 °C Operating temperature range
Storage Temperature TSTG -65 - 150 °C Storage temperature range
Package Type - - DIP-8 - - Package type

Instructions for Using TOP269EG

  1. Input Connection:

    • Connect the input voltage to the V<sub>IN</sub> pin.
    • Ensure the input voltage is within the specified range (180V to 375V).
  2. Output Connection:

    • Connect the load to the V<sub>OUT</sub> pin.
    • The output voltage is fixed at 5V, and the maximum output current is 1.5A.
  3. Ground Connection:

    • Connect the ground (GND) to the appropriate pin to ensure proper operation.
  4. Thermal Management:

    • Ensure adequate heat dissipation by mounting the device on a heatsink if operating at high loads or in high ambient temperatures.
    • The thermal resistance (θJA) is 50°C/W, so consider the power dissipation and ambient temperature to avoid overheating.
  5. Capacitor Selection:

    • Use appropriate input and output capacitors to filter noise and stabilize the voltage.
    • Typical values for input capacitors are 1μF to 10μF, and for output capacitors, 10μF to 100μF.
  6. Inductor Selection:

    • Choose an inductor with a value that matches the switching frequency (132kHz) and output current requirements.
    • A typical inductor value is 100μH to 330μH.
  7. Protection Circuits:

    • Implement overvoltage, undervoltage, and overcurrent protection circuits to ensure reliable operation and protect the device from faults.
  8. Layout Considerations:

    • Keep the layout compact to minimize parasitic inductance and capacitance.
    • Place high-frequency components close to the IC to reduce EMI.
  9. Testing and Validation:

    • Test the circuit under various load and temperature conditions to ensure it meets the performance specifications.
    • Verify the output voltage and current stability, and check for any signs of overheating or instability.

By following these instructions, you can ensure optimal performance and reliability of the TOP269EG in your application.

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