Details
BUY MT46V16M16-5BF https://www.utsource.net/itm/p/6085308.html
| Parameter | Description | Value | Unit |
|---|---|---|---|
| Product Name | High Density Synchronous DRAM | MT46V16M16-5BF | - |
| Memory Organization | Data Width x Row Address Bits x Column Address Bits x Banks | 16M x 16 | bits |
| Supply Voltage (Vcc) | Operating voltage for the core logic | 2.5 | V |
| Supply Voltage I/O (Vccq) | Operating voltage for I/O | 2.5 or 3.3 | V |
| Access Time (tAC) | Access time from clock | 5.0 | ns |
| Cycle Time (tCK) | Minimum cycle time | 5.0 | ns |
| CAS Latency (CL) | Number of clock cycles between the issuance of a read command and data output | 3 | clocks |
| Package Type | Packaging type | BGA | - |
| Operating Temperature | Range of operating temperatures | -40 to +85 | °C |
Instructions:
- Power Supply Requirements: Ensure that the supply voltages Vcc and Vccq are within specified limits before applying power to the device.
- Initialization Sequence: After applying power, perform an initialization sequence as per the datasheet guidelines to configure the DRAM properly.
- Clock Management: Use a stable clock source to avoid timing violations. The device supports a minimum cycle time of 5.0 ns.
- Address and Command Inputs: Provide address and command inputs synchronized with the clock signal. Ensure correct timing for reliable operation.
- Data Input/Output Handling: Manage data input/output carefully, ensuring that read and write operations respect the access times and CAS latency.
- Thermal Considerations: Operate within the specified temperature range to maintain performance and reliability. Implement adequate cooling if necessary.
- Storage Conditions: When not in use, store the device in conditions that do not exceed the maximum non-operating storage temperature.
For detailed specifications and advanced configurations, refer to the manufacturer’s datasheet.
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