Details

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BUY MT46V16M16CY-6IT:K https://www.utsource.net/itm/p/6085489.html

Parameter	Description	Value	Unit
Product Type	SDRAM
Organization	16M x 16		bits
Voltage Supply	VDD, VDDQ	2.5V ± 0.2V	V
Operating Temperature	Commercial	0°C to +70°C	°C
Industrial	-40°C to +85°C	°C
Access Time (tAC)	Access time	6.0	ns
Cycle Time (tCK)	Minimum cycle time	6.0	ns
CAS Latency (CL)	CAS latency	3	clocks
Burst Lengths	Available burst lengths	1, 2, 4, 8
Package Type	FBGA
Pins	Number of pins	60
I/O Standards	I/O voltage standards	SSTL_2
Refresh Rate	Refresh rate	8K refresh cycles/64ms

Instructions for Use:

1. Power Supply:

   • Ensure that the supply voltages VDD and VDDQ are set to 2.5V ± 0.2V.

2. Temperature Range:

   • Operate within the specified temperature range for reliable performance. For commercial applications, use between 0°C and +70°C. For industrial applications, use between -40°C and +85°C.

3. Timing Parameters:

   • Set the access time (tAC) to 6.0ns and the cycle time (tCK) to 6.0ns to match the device specifications.
   • Configure the CAS latency (CL) to 3 clock cycles.

4. Burst Length Configuration:

   • Choose from available burst lengths of 1, 2, 4, or 8 based on system requirements.

5. Package Handling:

   • Handle the FBGA package with care to avoid damage to the pins and ensure proper installation in the socket or PCB.

6. Refresh Operations:

   • Implement a refresh rate of 8K refresh cycles every 64 milliseconds to maintain data integrity.

7. I/O Standards:

   • Use SSTL_2 standards for I/O operations to ensure compatibility and signal integrity.

8. Installation:

   • Follow standard surface mount technology (SMT) procedures for mounting the component on the PCB. Ensure all connections are secure and free from solder bridges or shorts.

9. Testing:

   • After installation, perform functional tests to verify correct operation according to the datasheet specifications.

(For reference only)