Details

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BUY MC74HC273ADTR2G https://www.utsource.net/itm/p/6302563.html
Octal D Flip−Flop with Common Clock and Reset High−Performance Silicon−Gate CMOS

Parameter	Symbol	Conditions	Min	Typ	Max	Unit
Supply Voltage	VCC	Operating	2.0	-	6.0	V
Input Low Voltage	VIL	-	0.0	-	0.8	V
Input High Voltage	VIH	-	2.0	-	VCC	V
Output Low Voltage	VOL	IOL = 4 mA	0.0	-	0.1	V
Output High Voltage	VOH	IOH = -0.4 mA	VCC - 0.1	-	VCC	V
Propagation Delay Time	tpd	VCC = 4.5 V, fL = 10 MHz	6	-	12	ns
Power Dissipation	PD	Maximum	-	-	100	mW
Operating Temperature Range	TA	-	-40	-	85	°C
Storage Temperature Range	TSTG	-	-65	-	150	°C

Instructions for Use:

1. Power Supply:

   • Ensure the supply voltage (V_CC) is within the range of 2.0 V to 6.0 V.
   • Connect the ground (GND) pin to a stable 0 V reference.

2. Input Signals:

   • For a logic low input, ensure the voltage (V_IL) is between 0.0 V and 0.8 V.
   • For a logic high input, ensure the voltage (V_IH) is between 2.0 V and V_CC.

3. Output Signals:

   • When the output is low, the voltage (V_OL) should not exceed 0.1 V at a current of 4 mA.
   • When the output is high, the voltage (V_OH) should be at least V_CC - 0.1 V at a current of -0.4 mA.

4. Propagation Delay:

   • The propagation delay time (t_pd) is the time it takes for the output to respond to a change in the input. It should be between 6 ns and 12 ns under typical operating conditions.

5. Power Dissipation:

   • Do not exceed the maximum power dissipation (P_D) of 100 mW to avoid overheating and potential damage to the device.

6. Temperature Ranges:

   • The operating temperature range (T_A) is from -40°C to 85°C.
   • The storage temperature range (T_STG) is from -65°C to 150°C.

7. Handling:

   • Handle the device with care to avoid static discharge, which can damage the internal components.
   • Follow proper soldering techniques to ensure reliable connections without causing thermal stress to the device.

8. Storage:

   • Store the device in a dry, cool place away from direct sunlight and sources of heat or moisture.

9. Testing:

   • Before integrating the device into a circuit, test its functionality using a known good setup to ensure it meets the specified parameters.

(For reference only)