Details

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BUY NCT6776D https://www.utsource.net/itm/p/6406234.html
IC INTERFACE SPECIALIZED 128LQFP

Parameter	Description	Min	Typical	Max	Unit
Operating Voltage	Supply voltage range	3.0	-	3.6	V
Operating Temperature	Temperature range for normal operation	-40	-	85	°C
Storage Temperature	Temperature range for storage	-55	-	125	°C
Relative Humidity	Non-condensing humidity range	0	-	95	% RH
I/O Voltage	Input/output voltage range	1.65	-	3.6	V
Quiescent Current	Typical current consumption	-	1.0	-	mA
Output Drive Capability	High-level output current	-	10	-	mA
Low-level output current	-	-10	-	mA
Response Time	Time to respond to input changes	-	100	-	ns
ESD Protection	Human Body Model (HBM)	-	-	2000	V
Package Type	IC package type	-	TSSOP-28	-	-

Instructions for Using NCT6776D

1. Power Supply:

   • Ensure the supply voltage is within the specified range (3.0V to 3.6V).
   • Use a stable power source to avoid fluctuations that could affect performance.

2. Temperature Management:

   • Operate the device within the temperature range of -40°C to 85°C.
   • Store the device in an environment with temperatures between -55°C and 125°C.

3. Humidity Control:

   • Keep the relative humidity below 95% to prevent condensation and potential damage.

4. I/O Configuration:

   • Set the I/O voltage within the range of 1.65V to 3.6V.
   • Ensure proper termination and impedance matching for reliable signal transmission.

5. Current Consumption:

   • Monitor the quiescent current, which should be around 1.0mA under typical conditions.

6. Output Drive:

   • The device can drive up to 10mA for high-level outputs and sink up to 10mA for low-level outputs.

7. Response Time:

   • The typical response time is 100ns, which should be considered when designing timing-sensitive applications.

8. ESD Protection:

   • Handle the device with care to avoid electrostatic discharge (ESD), which can damage the IC.
   • Use appropriate ESD protection measures during handling and installation.

9. Package Handling:

   • The NCT6776D is available in a TSSOP-28 package. Follow standard PCB assembly guidelines for this package type.

10. Testing and Validation:

    • Perform thorough testing and validation to ensure the device meets the required specifications and operates correctly in the intended application.

(For reference only)