Details

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BUY MT41J128M16JT-125:K https://www.utsource.net/itm/p/6429161.html
IC DRAM 2G PARALLEL 96FBGA

Parameter	Description	Value
Device Type	Memory Type	DDR4 SDRAM
Density	Total Memory Capacity	16 Gb (2 Gb x 8)
Organization	Internal Organization	16 Banks x 8K Rows x 2K Columns x 32 Bits
Data Width	Data Bus Width	16 bits
Supply Voltage (VDD, VDDQ)	Operating Voltage	1.2 V ± 0.1 V
Operating Temperature	Industrial Temperature Range	-40°C to +125°C
Package	Package Type	FBGA (Fine Pitch Ball Grid Array)
Ball Pitch	Ball Pitch	0.8 mm
Ball Count	Number of Balls	78-Ball
Speed Grade	Access Time	12.5 ns (tCK = 1.25 ns)
CAS Latency (CL)	CAS Latency	9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24
Refresh Rate	Refresh Cycle Time	7.8 μs (tREFI)
Self-Refresh Exit Time	Self-Refresh Exit Time	64 ns (tXSR)
Power Down Exit Time	Power Down Exit Time	10 ns (tXP)
Write Recovery Time	Write Recovery Time	12.5 ns (tWR)
Active to Precharge Delay	Active to Precharge Delay	12.5 ns (tRAS)
Row Cycle Time	Row Cycle Time	37.5 ns (tRC)
Precharge Command to Active Command	Precharge Command to Active Command	12.5 ns (tRP)
Input Clamping Diode	Input Clamping Diode	Yes
Package Marking	Package Marking	MT41J128M16JT-125:K

Instructions for Use:

1. Power Supply: Ensure that the supply voltage (VDD, VDDQ) is within the specified range of 1.2 V ± 0.1 V.
2. Temperature Range: Operate the device within the industrial temperature range of -40°C to +125°C.
3. Signal Integrity: Use proper signal integrity practices to minimize noise and ensure reliable operation.
4. Timing Parameters: Adhere to the specified timing parameters, such as CAS latency, refresh rate, and various delay times, to ensure correct memory operation.
5. Power Management: Utilize power-down and self-refresh modes to reduce power consumption when the device is not actively being used.
6. Initialization: Follow the initialization sequence recommended by the manufacturer to ensure the device is properly configured before use.
7. Handling: Handle the device with care to avoid damage to the sensitive FBGA package.
8. Storage: Store the device in a dry, static-free environment to prevent damage.

(For reference only)