Details

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BUY SN74AHCT244DGVR https://www.utsource.net/itm/p/6462287.html
2014-11-11

Parameter	Description	Min	Typ	Max	Unit
VCC (Operating Supply Voltage)	Supply voltage range	2.0	-	5.5	V
ICC (Supply Current)	Quiescent supply current per gate at TA = 25°C, VIH = VCC, VIL = 0V	-	1.0	-	μA
IOH (Output High-Level Current)	Output high-level current at VOH = 2.4V, VCC = 5V	-	24	-	mA
IOL (Output Low-Level Current)	Output low-level current at VOL = 0.4V, VCC = 5V	-	24	-	mA
tpd (Propagation Delay Time)	Propagation delay time from input to output at VCC = 5V, TA = 25°C	-	12	-	ns
tphl (High-to-Low Propagation Delay Time)	High-to-low propagation delay time at VCC = 5V, TA = 25°C	-	12	-	ns
tplh (Low-to-High Propagation Delay Time)	Low-to-high propagation delay time at VCC = 5V, TA = 25°C	-	12	-	ns
VIH (Input High-Level Voltage)	Input high-level voltage	2.0	-	VCC	V
VIL (Input Low-Level Voltage)	Input low-level voltage	0	-	0.8	V
VOH (Output High-Level Voltage)	Output high-level voltage at IOH = -4mA, VCC = 5V	2.4	-	VCC - 0.1	V
VOL (Output Low-Level Voltage)	Output low-level voltage at IOL = 4mA, VCC = 5V	0	-	0.4	V

Instructions for Use:

1. Power Supply:

   • Ensure the supply voltage (V_CC) is within the specified range of 2.0V to 5.5V.
   • Connect the ground (GND) pin to a stable reference ground.

2. Input Signals:

   • Apply input signals (VIH and VIL) within the specified voltage levels.
   • Ensure input signals do not exceed V_CC or go below GND to avoid damage to the device.

3. Output Loads:

   • The device can source or sink up to 24mA per output.
   • Ensure the load connected to the output does not exceed these current limits to prevent overheating or damage.

4. Propagation Delay:

   • Account for the propagation delay times (t_pd, t_phl, t_plh) in your timing calculations to ensure proper operation of the circuit.

5. Temperature Range:

   • The device is designed to operate over a wide temperature range, but performance parameters are typically specified at 25°C. Check the datasheet for specific temperature dependencies if operating outside this range.

6. Storage and Handling:

   • Store the device in a dry environment to prevent moisture damage.
   • Handle with care to avoid static discharge, which can damage the sensitive components.

7. Mounting:

   • Follow standard surface mount technology (SMT) procedures for mounting the device on a PCB.
   • Ensure proper soldering and cooling to avoid thermal stress on the device.

8. Testing:

   • Test the device using a known good signal source and load to verify correct operation.
   • Refer to the datasheet for detailed test procedures and recommended test conditions.

(For reference only)