Details

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BUY TLP759(J,F) https://www.utsource.net/itm/p/6493310.html
Optocoupler DC-IN 1-CH Transistor With Base DC-OUT 8-Pin PDIP (Alt: TLP759JF)

Parameter	Symbol	Min	Typ	Max	Unit	Conditions
Forward Voltage	VF	-	1.2	1.6	V	IF = 20 mA, TA = 25掳C
Peak Forward Current	IF(PK)	-	-	30	mA	tP = 1 ms, IF(AV) = 20 mA
Continuous Forward Current	IF(AV)	-	-	20	mA	TA = 25掳C
Reverse Voltage	VR	-	-	5	V	IR = 10 渭A, TA = 25掳C
Output Current (Low Level)	IOL	-	8	16	mA	VCC = 5 V, RL = 500 惟, VO = 0.4 V
Output Voltage (High Level)	VOH	2.4	3.6	4.4	V	VCC = 5 V, IL = 0.4 mA, VI = 0 V
Propagation Delay Time	tPLH, tPHL	-	10	30	ns	VCC = 5 V, IF = 20 mA, IL = 10 mA, VI = 5 V, VO = 0.4 V or 2.4 V
Storage Temperature Range	TSTG	-40	-	105	掳C	-
Operating Temperature Range	TA	-40	-	85	掳C	-

Instructions for Use:

1. Forward Current (IF):

   • Ensure that the forward current does not exceed 20 mA continuously to avoid damaging the device.
   • For short pulses, the peak forward current can be up to 30 mA with a pulse width of 1 ms.

2. Reverse Voltage (VR):

   • The device can withstand a reverse voltage of up to 5 V without exceeding a reverse leakage current of 10 渭A.

3. Output Current (IOL):

   • When the output is low, the device can sink up to 16 mA at V_CC = 5 V and RL = 500 惟.

4. Output Voltage (VOH):

   • When the output is high, the voltage level should be between 2.4 V and 4.4 V at V_CC = 5 V and IL = 0.4 mA.

5. Propagation Delay Time:

   • The propagation delay time from input to output should be considered when designing circuits to ensure proper timing.

6. Temperature Ranges:

   • Store the device within the temperature range of -40掳C to 105掳C.
   • Operate the device within the temperature range of -40掳C to 85掳C to ensure reliable performance.

7. Mounting and Handling:

   • Handle the device with care to avoid mechanical stress.
   • Follow standard ESD (Electrostatic Discharge) precautions to prevent damage to the device.

8. Soldering:

   • Use appropriate soldering techniques and temperatures to avoid thermal damage to the device.

9. Testing:

   • Test the device under specified conditions to ensure it meets the required parameters before integrating it into your application.

(For reference only)