IS41C16100C-50KLI

IS41C16100C-50KLI

Category: IC Chips

Specifications
SKU
7275556
Details

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DRAM Chip EDO 16Mbit 1Mx16 5V 42-Pin SOJ
Parameter Description Value
Device Type Type of Memory 16M-Bit CMOS SRAM (2M x 8)
Supply Voltage (Vcc) Operating Supply Voltage Range 2.7V to 3.6V
Standby Current (Icc) Standby Current at Vcc = 3.0V 1.0 μA (max)
Active Current (Icc) Active Current at Vcc = 3.0V, f = 50 MHz 35 mA (max)
Access Time (tAC) Access Time from Clock Edge 5 ns (max)
Cycle Time (tCYC) Minimum Cycle Time 10 ns (max)
Data Hold Time (tDH) Data Hold Time 1 ns (min)
Data Setup Time (tDS) Data Setup Time 2 ns (min)
Address Setup Time (tAS) Address Setup Time 2 ns (min)
Address Hold Time (tAH) Address Hold Time 1 ns (min)
Output Enable Time (tOE) Output Enable Time 2 ns (min)
Write Enable Time (tWE) Write Enable Time 2 ns (min)
Power-down Time (tPD) Power-down Time 100 ns (min)
Operating Temperature (Toper) Operating Temperature Range -40°C to +85°C
Storage Temperature (Tstg) Storage Temperature Range -65°C to +150°C
Package Type Package Type 44-pin TQFP (Thin Quad Flat Pack)
RoHS Compliance RoHS Compliant Yes

Instructions for Use:

  1. Power Supply:

    • Ensure the supply voltage (Vcc) is within the specified range of 2.7V to 3.6V.
    • Connect the ground (GND) pin to a stable ground reference.
  2. Signal Timing:

    • Ensure all timing parameters such as access time, cycle time, data setup, and hold times are met to avoid data corruption.
    • Use appropriate decoupling capacitors near the power pins to reduce noise and ensure stable operation.
  3. Power Management:

    • To enter power-down mode, set the chip enable (CE) and output enable (OE) pins high while keeping the write enable (WE) pin low.
    • The device will resume normal operation when CE or OE is brought low.
  4. Data Input/Output:

    • Data input should be stable during the write cycle, and data output should be sampled after the read cycle has completed.
    • Use pull-up resistors on the data lines if necessary to ensure proper logic levels.
  5. Addressing:

    • Address lines must be stable before the address setup time (tAS) and held stable for the address hold time (tAH).
  6. Environmental Considerations:

    • Operate the device within the specified temperature ranges to avoid damage.
    • Store the device in a dry environment to prevent moisture-related issues.
  7. Handling:

    • Handle the device with care to avoid static discharge and physical damage.
    • Follow standard ESD (Electrostatic Discharge) precautions when handling the device.
  8. Testing:

    • Before integrating the device into a system, perform basic functionality tests to ensure it meets the specified parameters.
    • Use a test pattern to verify read and write operations across the entire memory array.
(For reference only)

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