Details

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BUY MAX313LCPE+ https://www.utsource.net/itm/p/7421431.html
4 Circuit IC Switch 1:1 10 Ohm 16-PDIP

Parameter	Symbol	Conditions	Min	Typical	Max	Unit
Supply Voltage	VCC	Operating	2.7	-	5.25	V
Output Current per Channel	IOL	VOH = 2.4V, VCC = 5V	-20	-	-	mA
Output Current per Channel	IOH	VOL = 0.4V, VCC = 5V	-	-	20	mA
Input Current per Channel	IIL	VIN = 0V	-1	-	-	μA
Input Current per Channel	IIH	VIN = VCC	-	-	1	μA
Propagation Delay Time	tpd	VCC = 5V, VI = VO = 1.65V to 3.3V	-	10	-	ns
Power Dissipation	PD	Continuous	-	-	700	mW
Operating Temperature Range	TA	Commercial	0	-	70	°C
Operating Temperature Range	TA	Industrial	-40	-	85	°C

Instructions for Use:

1. Power Supply:

   • Ensure the supply voltage (V_CC) is within the specified range of 2.7V to 5.25V.
   • Use a stable power source to avoid voltage fluctuations that could affect device performance.

2. Input and Output Currents:

   • Do not exceed the maximum output current (I_OL, I_OH) of ±20mA per channel to prevent damage to the device.
   • Ensure input currents (I_IL, I_IH) are within the specified limits to avoid excessive power consumption or overheating.

3. Propagation Delay:

   • The propagation delay time (t_pd) is typically 10ns under standard conditions. This value should be considered when designing timing-sensitive circuits.

4. Power Dissipation:

   • The maximum power dissipation (P_D) is 700mW. Ensure adequate heat sinking or cooling if operating near this limit to prevent thermal damage.

5. Temperature Range:

   • Choose the appropriate temperature range (Commercial: 0°C to 70°C, Industrial: -40°C to 85°C) based on the application environment to ensure reliable operation.

6. Handling:

   • Handle the device with care to avoid static discharge, which can damage sensitive components.
   • Follow proper soldering techniques and use appropriate tools to avoid mechanical stress during installation.

7. Storage:

   • Store the device in a dry, cool place away from direct sunlight and sources of heat to maintain its integrity.

8. Testing:

   • Perform initial testing at room temperature to verify functionality before deploying in more extreme environments.
   • Regularly inspect and test the device to ensure it continues to meet performance specifications.

(For reference only)