Details

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BUY SN74LVCH244ANSR https://www.utsource.net/itm/p/7537529.html
Buffer, Non-Inverting 2 Element 4 Bit per Element Push-Pull Output 20-SO

Parameter	Symbol	Conditions	Min	Typ	Max	Unit
Supply Voltage	VCC	Operating	1.65	-	3.6	V
Input Voltage (High)	VIH	-	0.7 × VCC	-	-	V
Input Voltage (Low)	VIL	-	-	-	0.3 × VCC	V
Output Voltage (High)	VOH	IOL = -4 mA	0.8 × VCC	-	-	V
Output Voltage (Low)	VOL	IOH = 4 mA	-	-	0.2 × VCC	V
Propagation Delay Time	tpd	VCC = 3.3 V, TA = 25°C	3.5	-	-	ns
Power Dissipation	PD	Per Package	-	-	360	mW
Operating Temperature Range	TA	-	-40	-	85	°C
Storage Temperature Range	TSTG	-	-65	-	150	°C

Instructions for Use:

1. Power Supply:

   • Ensure the supply voltage (V_CC) is within the specified range of 1.65V to 3.6V.
   • Connect the ground (GND) pin to a stable 0V reference.

2. Input Signals:

   • Input voltages should be within the valid logic levels:
     • High: V_IH ≥ 0.7 × V_CC
     • Low: V_IL ≤ 0.3 × V_CC

3. Output Signals:

   • Output voltages will be:
     • High: V_OH ≥ 0.8 × V_CC when I_OL = -4 mA
     • Low: V_OL ≤ 0.2 × V_CC when I_OH = 4 mA

4. Propagation Delay:

   • The propagation delay time (t_pd) is typically 3.5 ns at V_CC = 3.3V and T_A = 25°C. This value may vary with different supply voltages and temperatures.

5. Thermal Considerations:

   • Ensure the device operates within the specified temperature ranges:
     • Operating Temperature (T_A): -40°C to 85°C
     • Storage Temperature (T_STG): -65°C to 150°C

6. Power Dissipation:

   • The maximum power dissipation per package is 360 mW. Ensure proper heat sinking or cooling if operating near this limit.

7. Handling:

   • Handle the device with care to avoid static damage. Use proper ESD protection measures during handling and installation.

8. Layout and PCB Design:

   • Ensure a clean and well-designed PCB layout to minimize noise and interference. Use decoupling capacitors close to the power pins to stabilize the supply voltage.

(For reference only)