Details

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BUY 74FCT244ATSOG https://www.utsource.net/itm/p/7539738.html
Buffer, Non-Inverting 2 Element 4 Bit per Element Push-Pull Output 20-SOIC

Parameter	Description	Value
Part Number	Full part number	74FCT244ATSOG
Function	Octal non-inverting buffers/line drivers with three-state outputs
Supply Voltage (Vcc)	Operating supply voltage	3.3V to 5.5V
Output Current (Ioh/Iol)	Output high/low current	±16mA
Input Current (Iih/Iil)	Input high/low current	0.1μA / 1μA
Propagation Delay (tpd)	Propagation delay time	3.5ns (typical) at Vcc = 5V
Power Dissipation (Pd)	Maximum power dissipation	350mW (derated linearly above 25°C)
Operating Temperature	Operating temperature range	-40°C to +85°C
Storage Temperature	Storage temperature range	-65°C to +150°C
Package Type	Package type	TSSOP-20 (Thin Shrink Small Outline Package)
Pin Count	Number of pins	20
Mounting Type	Mounting type	Surface Mount

Instructions for Use:

1. Power Supply:

   • Connect the Vcc pin to the positive supply voltage (3.3V to 5.5V).
   • Connect the GND pin to the ground.

2. Input Signals:

   • Apply logic input signals to the input pins (1A, 2A, ..., 8A).
   • Ensure that the input voltages are within the specified range to avoid damage.

3. Output Control:

   • The output enable (OE) pin controls the state of the outputs.
   • When OE is low, the outputs are active.
   • When OE is high, the outputs are in a high-impedance state (three-state).

4. Output Connections:

   • Connect the output pins (1Y, 2Y, ..., 8Y) to the load or next stage of the circuit.
   • Ensure that the load does not exceed the maximum output current ratings.

5. Decoupling Capacitors:

   • Place a 0.1μF ceramic decoupling capacitor as close as possible to the Vcc and GND pins to filter out noise and stabilize the supply voltage.

6. Thermal Management:

   • Ensure adequate heat dissipation if operating near the maximum power dissipation limits.
   • Consider using a heatsink or thermal pad if necessary.

7. Handling:

   • Handle the device with care to avoid static damage.
   • Follow proper ESD (Electrostatic Discharge) precautions during handling and installation.

8. Storage:

   • Store the device in a dry, cool place within the specified storage temperature range to prevent damage.

9. Testing:

   • Test the device in a controlled environment to ensure it meets the specified performance parameters before integrating it into the final design.

(For reference only)