Details

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BUY STR-Y6766 https://www.utsource.net/itm/p/7556752.html
Converter Offline Flyback Topology 18.4kHz ~ 24.4kHz TO-220-7

Parameter	Symbol	Min	Typ	Max	Unit	Description
Supply Voltage	Vcc	2.5	3.3	5.5	V	Operating voltage range
Output Current	Iout	-	100	200	mA	Maximum continuous output current
Quiescent Current	Iq	-	10	20	μA	Current consumption in active state
Shutdown Current	Isd	-	1	5	μA	Current consumption in shutdown mode
Output Voltage	Vout	-	-	-	V	Regulated output voltage (set by external resistors)
Dropout Voltage	Vdo	-	100	300	mV	Voltage difference between input and output
Operating Temperature	Topr	-40	-	85	°C	Ambient temperature range
Storage Temperature	Tstg	-55	-	150	°C	Temperature range for storage
Thermal Resistance	Rth	-	60	-	°C/W	Junction-to-ambient thermal resistance

Instructions for STR-Y6766

1. Supply Voltage:

   • Ensure the supply voltage is within the range of 2.5V to 5.5V to avoid damage to the device.

2. Output Current:

   • The maximum continuous output current is 200mA. Do not exceed this limit to prevent overheating and potential failure.

3. Quiescent Current:

   • The quiescent current is typically 10μA. This is the current consumed by the device when it is active but not driving any load.

4. Shutdown Current:

   • When the device is in shutdown mode, the current consumption drops to a typical value of 1μA. Use the shutdown pin to control this mode.

5. Output Voltage:

   • The output voltage is set using external resistors. Refer to the datasheet for the specific resistor values required for your desired output voltage.

6. Dropout Voltage:

   • The dropout voltage is the minimum difference between the input and output voltages required to maintain regulation. It is typically 100mV at light loads and can increase to 300mV at higher loads.

7. Operating Temperature:

   • The device can operate in ambient temperatures ranging from -40°C to 85°C. Ensure adequate heat dissipation if operating near the upper limit.

8. Storage Temperature:

   • Store the device in temperatures ranging from -55°C to 150°C. Avoid exposing the device to extreme temperatures for extended periods.

9. Thermal Resistance:

   • The junction-to-ambient thermal resistance is 60°C/W. Ensure proper heat sinking if the device will be operating at high power levels or in high ambient temperatures.

10. Layout Considerations:

    • Place the input and output capacitors as close as possible to the device to minimize noise and improve stability.
    • Use a ground plane to help dissipate heat and reduce electromagnetic interference (EMI).

11. Handling Precautions:

    • Handle the device with care to avoid static discharge, which can damage sensitive components.
    • Follow recommended soldering profiles to avoid thermal stress during assembly.

12. Testing:

    • Before finalizing the design, test the device under various conditions to ensure it meets the required specifications and performance criteria.

(For reference only)