Details

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BUY IR2105STR https://www.utsource.net/itm/p/7560874.html
Half-Bridge Gate Driver IC Non-Inverting 8-SOIC

Parameter	Symbol	Min	Typical	Max	Unit
Supply Voltage (High Side)	VHB	-0.3	-	20.0	V
Supply Voltage (Low Side)	VSB	-0.3	-	18.0	V
Gate Drive Output Voltage	VGS	-0.5	10.0	17.0	V
Gate Drive Output Current	IOUT	-	±1.2	-	A
Input High Level Voltage	VIH	2.0	-	18.0	V
Input Low Level Voltage	VIL	-0.3	-	0.8	V
Propagation Delay Time	td	-	60.0	-	ns
Rise Time	tr	-	25.0	-	ns
Fall Time	tf	-	25.0	-	ns
Operating Temperature Range	TA	-40	-	125	°C
Storage Temperature Range	TSTG	-55	-	150	°C

Instructions for IR2105STR

1. Power Supply Connections:

   • Connect the high-side supply voltage (V_HB) to the appropriate pin.
   • Connect the low-side supply voltage (V_SB) to the appropriate pin.
   • Ensure that the supply voltages are within the specified range to avoid damage.

2. Gate Drive Outputs:

   • The gate drive outputs (HO and LO) should be connected to the gates of the high-side and low-side MOSFETs, respectively.
   • Ensure that the gate drive output voltage (V_GS) is within the specified range to ensure proper operation of the MOSFETs.

3. Input Signals:

   • Apply the input signals (IN and SD) according to the logic levels specified.
   • Use a pull-up resistor for the IN and SD pins if they are not actively driven to avoid floating inputs.

4. Bootstrap Capacitor:

   • For high-side operation, a bootstrap capacitor (C_B) must be connected between the HO and VS pins.
   • The bootstrap capacitor should be selected based on the switching frequency and current requirements.

5. Dead Time Control:

   • The dead time between the high-side and low-side switches can be adjusted using an external resistor (R_DT) connected to the DT pin.
   • Proper dead time ensures that both switches do not turn on simultaneously, which can cause shoot-through and damage the MOSFETs.

6. Thermal Management:

   • Ensure adequate heat dissipation by mounting the IC on a heatsink or PCB with sufficient copper area.
   • Monitor the operating temperature to ensure it remains within the specified range.

7. Storage and Handling:

   • Store the device in a dry, cool place away from direct sunlight.
   • Handle the device with care to avoid electrostatic discharge (ESD) damage.

8. Testing and Troubleshooting:

   • Verify all connections before applying power to the circuit.
   • Use a multimeter or oscilloscope to check the voltages and waveforms at various points in the circuit.
   • Refer to the datasheet for more detailed troubleshooting information.

(For reference only)