Details
BUY IX6R11P7 https://www.utsource.net/itm/p/7561249.html
Half-Bridge Gate Driver IC Non-Inverting 14-DIP
| Parameter | Value | Unit |
|---|---|---|
| Part Number | IX6R11P7 | - |
| Type | MOSFET | - |
| Package | TO-252 | - |
| Maximum Drain-Source Voltage (VDS) | 60 | V |
| Maximum Gate-Source Voltage (VGS) | ±20 | V |
| Continuous Drain Current (ID) | 11 | A |
| Peak Pulse Drain Current (IDM) | 34 | A |
| Total Power Dissipation (PD) | 2.8 | W |
| Junction Temperature (TJ) | -55 to 150 | °C |
| Storage Temperature (TSTG) | -65 to 150 | °C |
| Gate Charge (QG) | 19 | nC |
| Input Capacitance (Ciss) | 1100 | pF |
| Output Capacitance (Coss) | 150 | pF |
| Reverse Transfer Capacitance (Crss) | 220 | pF |
| RDS(on) at VGS = 10V | 1.1 | Ω |
Instructions:
Handling Precautions:
- Avoid exposing the device to temperatures outside the specified range.
- Use appropriate ESD protection when handling the device.
Mounting:
- Ensure proper heat sinking if operating near the maximum power dissipation.
- Follow recommended soldering profiles to avoid thermal shock.
Operation:
- Do not exceed the maximum ratings for VDS, VGS, and ID.
- Ensure the gate voltage is within the specified limits to prevent damage.
- Monitor the junction temperature to avoid overheating.
Storage:
- Store in a dry, cool place within the specified storage temperature range.
- Protect from moisture and static electricity.
Testing:
- Use a suitable test setup to verify the parameters.
- Refer to the datasheet for detailed testing procedures and conditions.
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