Details

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BUY W9864G2JH-6 https://www.utsource.net/itm/p/7583315.html
SDRAM Memory IC 64Mb (2M x 32) Parallel 166MHz 5ns 86-TSOP II

Parameter	Value
Manufacturer	Winbond Electronics
Part Number	W9864G2JH-6
Type	NAND Flash Memory
Capacity	64 Gb (8 GB)
Voltage Supply (Vcc)	1.8V ± 0.1V
Operating Temperature	-40°C to +85°C
Package	BGA 169
Data I/O Pins	8-bit
Access Time	50 ns
Endurance	3,000 Program/Erase Cycles
Data Retention	10 years
ECC Requirement	Up to 24 bits/1024 bytes
Features	ONFI 2.3 Compliant

Instructions for Use

1. Power Supply:

   • Ensure the supply voltage is within the specified range of 1.8V ± 0.1V.
   • Use appropriate decoupling capacitors near the power pins to minimize noise.

2. Temperature Range:

   • Operate the device within the temperature range of -40°C to +85°C to ensure reliable performance.

3. Pin Configuration:

   • Refer to the pin configuration diagram provided in the datasheet to correctly connect the device.
   • Pay special attention to the Vcc, Vss, and I/O pins.

4. Data I/O:

   • The device supports 8-bit data I/O. Ensure that the data lines are properly terminated and shielded to avoid signal integrity issues.

5. Programming and Erasing:

   • Follow the programming and erasing procedures as outlined in the datasheet.
   • Use the recommended ECC (Error Correction Code) algorithms to maintain data integrity.

6. Initialization:

   • Initialize the device by sending the appropriate commands as specified in the datasheet.
   • Verify the device status after initialization to ensure it is ready for operation.

7. Data Retention:

   • Store the device in a controlled environment to maximize data retention.
   • Perform periodic refresh operations if the device will be stored for extended periods.

8. Handling:

   • Handle the device with care to avoid physical damage.
   • Use ESD (Electrostatic Discharge) protection measures when handling the device to prevent damage.

9. Documentation:

   • Refer to the datasheet and application notes for detailed information on advanced features and specific use cases.

For more detailed information, refer to the official datasheet and application notes provided by Winbond Electronics.

(For reference only)