Details
BUY LV8727-E https://www.utsource.net/itm/p/7615070.html
Bipolar Motor Driver BiCDMOS Parallel 25-HZIP
| Parameter | Symbol | Conditions | Min | Typ | Max | Unit |
|---|---|---|---|---|---|---|
| Supply Voltage | VCC | Operating | 4.5 | - | 5.5 | V |
| Output Current per Channel | IOUT | Continuous | - | 1.0 | 1.5 | A |
| Operating Temperature | TOPR | Storage/Operating | -40 | - | 85 | °C |
| Thermal Shutdown | TSD | Activation | - | - | 150 | °C |
| Under-Voltage Lockout | UVLO | Threshold | - | 3.8 | - | V |
| Shutdown Current | ISD | VCC = 5V | - | 1.0 | - | μA |
| Output Voltage Drop | VD | IOUT = 1A | - | 0.3 | - | V |
Instructions for Use
Power Supply:
- Ensure the supply voltage (VCC) is within the range of 4.5V to 5.5V.
- Use a stable power source to avoid fluctuations that could affect performance.
Output Current:
- The LV8727-E can provide up to 1.5A continuous output current per channel.
- For optimal performance, keep the output current within the typical range of 1A.
Temperature Management:
- The operating temperature range is from -40°C to 85°C.
- Avoid exceeding the thermal shutdown temperature of 150°C to prevent damage.
Under-Voltage Lockout (UVLO):
- The device will enter a shutdown state if the supply voltage drops below 3.8V.
- Ensure the power supply is stable to avoid unintended shutdowns.
Shutdown Mode:
- In shutdown mode, the current consumption is approximately 1.0μA.
- Use this mode to conserve power when the device is not in use.
Output Voltage Drop:
- The output voltage drop (VD) at 1A is typically 0.3V.
- This should be considered when designing the circuit to ensure the load receives the required voltage.
Thermal Considerations:
- Proper heat sinking or cooling mechanisms may be necessary for applications with high current loads to maintain safe operating temperatures.
Storage:
- Store the device in a dry environment to prevent moisture damage.
- Follow ESD (Electrostatic Discharge) precautions to avoid damaging the device during handling.
Mounting:
- Ensure proper soldering techniques are used to avoid thermal and mechanical stress on the device.
- Follow the recommended PCB layout guidelines provided by the manufacturer for optimal performance.
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