LV8727-E

LV8727-E


Specifications
SKU
7615070
Details

BUY LV8727-E https://www.utsource.net/itm/p/7615070.html
Bipolar Motor Driver BiCDMOS Parallel 25-HZIP
Parameter Symbol Conditions Min Typ Max Unit
Supply Voltage VCC Operating 4.5 - 5.5 V
Output Current per Channel IOUT Continuous - 1.0 1.5 A
Operating Temperature TOPR Storage/Operating -40 - 85 °C
Thermal Shutdown TSD Activation - - 150 °C
Under-Voltage Lockout UVLO Threshold - 3.8 - V
Shutdown Current ISD VCC = 5V - 1.0 - μA
Output Voltage Drop VD IOUT = 1A - 0.3 - V

Instructions for Use

  1. Power Supply:

    • Ensure the supply voltage (VCC) is within the range of 4.5V to 5.5V.
    • Use a stable power source to avoid fluctuations that could affect performance.
  2. Output Current:

    • The LV8727-E can provide up to 1.5A continuous output current per channel.
    • For optimal performance, keep the output current within the typical range of 1A.
  3. Temperature Management:

    • The operating temperature range is from -40°C to 85°C.
    • Avoid exceeding the thermal shutdown temperature of 150°C to prevent damage.
  4. Under-Voltage Lockout (UVLO):

    • The device will enter a shutdown state if the supply voltage drops below 3.8V.
    • Ensure the power supply is stable to avoid unintended shutdowns.
  5. Shutdown Mode:

    • In shutdown mode, the current consumption is approximately 1.0μA.
    • Use this mode to conserve power when the device is not in use.
  6. Output Voltage Drop:

    • The output voltage drop (VD) at 1A is typically 0.3V.
    • This should be considered when designing the circuit to ensure the load receives the required voltage.
  7. Thermal Considerations:

    • Proper heat sinking or cooling mechanisms may be necessary for applications with high current loads to maintain safe operating temperatures.
  8. Storage:

    • Store the device in a dry environment to prevent moisture damage.
    • Follow ESD (Electrostatic Discharge) precautions to avoid damaging the device during handling.
  9. Mounting:

    • Ensure proper soldering techniques are used to avoid thermal and mechanical stress on the device.
    • Follow the recommended PCB layout guidelines provided by the manufacturer for optimal performance.
(For reference only)

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