Details

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BUY VNQ810M13TR https://www.utsource.net/itm/p/7626783.html
IC SSR HISIDE QUAD 28-SOIC

Parameter	Symbol	Min	Typ	Max	Unit	Notes
Supply Voltage	VDD	4.5	-	5.5	V
Continuous Drain Current	ID(cont)	-	1.2	-	A	@ TA = 25°C
Peak Drain Current	ID(peak)	-	2.0	-	A	@ TA = 25°C, tp = 10 ms, Duty Cycle = 1%
Gate-Source Voltage	VGS(th)	1.0	1.5	2.0	V	@ ID = 250 μA
Drain-Source On-State Resistance	RDS(on)	-	0.55	-	Ω	@ VGS = 4.5 V, ID = 1.2 A
Maximum Junction Temperature	TJ(max)	-	-	150	°C
Storage Temperature Range	TSTG	-40	-	150	°C
Operating Temperature Range	TA	-40	-	85	°C

Instructions for Use

1. Supply Voltage (V_DD):

   • Ensure the supply voltage is within the range of 4.5 V to 5.5 V to avoid damage to the device.

2. Continuous Drain Current (I_D(cont)):

   • The device can handle a continuous drain current of up to 1.2 A at ambient temperature (T_A = 25°C). Exceeding this value may cause overheating and damage.

3. Peak Drain Current (I_D(peak)):

   • For short bursts, the device can handle up to 2.0 A with a pulse duration of 10 ms and a duty cycle of 1%. Ensure adequate heat dissipation for extended use.

4. Gate-Source Voltage (V_GS(th)):

   • The threshold voltage for turning on the MOSFET is between 1.0 V and 2.0 V. Apply a gate-source voltage greater than 1.5 V to ensure reliable operation.

5. Drain-Source On-State Resistance (R_DS(on)):

   • At a gate-source voltage of 4.5 V and a drain current of 1.2 A, the on-state resistance is typically 0.55 Ω. This affects power dissipation and should be considered in thermal design.

6. Maximum Junction Temperature (T_J(max)):

   • The maximum junction temperature is 150°C. Ensure proper heat sinking or cooling to prevent exceeding this limit.

7. Storage Temperature Range (T_STG):

   • Store the device in an environment where the temperature ranges from -40°C to 150°C.

8. Operating Temperature Range (T_A):

   • The device is designed to operate within an ambient temperature range of -40°C to 85°C. Ensure the operating environment does not exceed these limits.

Additional Notes

• Always refer to the datasheet for detailed specifications and application notes.
• Proper PCB layout and thermal management are crucial for reliable operation.
• Ensure all connections are secure and free from shorts or open circuits.

(For reference only)