SI1488DH-T1-E3
Specifications
Details
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| Parameter | Symbol | Conditions | Min | Typ | Max | Unit |
|---|---|---|---|---|---|---|
| Supply Voltage | VDD | Operating | 1.6 | 5.5 | V | |
| Quiescent Current | IQ | VDD = 5V | 30 | μA | ||
| Output Current | IO | Continuous | 200 | mA | ||
| Breakdown Voltage | BV | IO = 1mA | 40 | V | ||
| Forward Voltage | VF | IO = 200mA | 1.2 | 1.8 | V | |
| Power Dissipation | PD | 600 | mW | |||
| Junction Temperature | Tj | Operating | -40 | 125 | °C | |
| Storage Temperature | Tstg | -65 | 150 | °C |
Instructions for SI1488DH-T1-E3
Power Supply Connection:
- Connect the supply voltage (VDD) within the range of 1.6V to 5.5V.
- Ensure the power supply is stable and within specified limits to avoid damage.
Handling Static Electricity:
- The device is sensitive to static electricity. Handle with care, preferably using anti-static equipment.
Operating Temperature:
- Operate the device within the junction temperature range of -40°C to 125°C to ensure reliable performance.
Output Current Limitation:
- Do not exceed the maximum continuous output current of 200mA to prevent overheating and potential damage.
Power Dissipation Management:
- Keep the power dissipation below 600mW. Use appropriate heat sinking if necessary.
Storage Conditions:
- Store the device in a controlled environment within the temperature range of -65°C to 150°C.
Soldering Process:
- Follow standard soldering practices. Avoid excessive heat during soldering to prevent damage to the device.
Electrical Characteristics:
- Refer to the parameter table for specific electrical characteristics under different operating conditions.
Application Specific Guidelines:
- For application-specific guidelines and recommendations, refer to the datasheet or consult the manufacturer’s technical support.
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