Details

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BUY FGH40N60SFD TO-247 https://www.utsource.net/itm/p/8647210.html

Parameter	Symbol	Min	Typ	Max	Unit	Description
Drain-Source Voltage	VDS	-	600	-	V	Maximum voltage that can be applied between the drain and source with the gate shorted to the source.
Gate-Source Voltage	VGS	-20	-	20	V	Maximum voltage that can be applied between the gate and source.
Continuous Drain Current (TC = 25掳C)	ID	-	40	-	A	Maximum continuous current that can flow through the drain to the source at a case temperature of 25掳C.
Continuous Drain Current (TC = 100掳C)	ID	-	25	-	A	Maximum continuous current that can flow through the drain to the source at a case temperature of 100掳C.
Pulse Drain Current (TC = 25掳C, tp = 10 ms, Duty Cycle = 1%)	ID(pulse)	-	120	-	A	Maximum pulse current that can flow through the drain to the source at a case temperature of 25掳C, with a pulse duration of 10 ms and a duty cycle of 1%.
Power Dissipation (TC = 25掳C)	PD	-	280	-	W	Maximum power dissipation at a case temperature of 25掳C.
Power Dissipation (TC = 100掳C)	PD	-	180	-	W	Maximum power dissipation at a case temperature of 100掳C.
Junction Temperature	TJ	-	-	150	掳C	Maximum operating temperature of the junction.
Storage Temperature Range	TSTG	-55	-	150	掳C	Temperature range over which the device can be stored without damage.
Total Device Dissipation (TA = 25掳C)	PTOT	-	300	-	W	Maximum total power dissipation at ambient temperature of 25掳C.

Instructions for Use:

1. Mounting and Handling:

   • Ensure proper heat sinking to maintain the junction temperature within the specified limits.
   • Handle the device with care to avoid mechanical stress and damage to the leads.

2. Electrical Connections:

   • Connect the drain, source, and gate terminals correctly to avoid damage.
   • Use appropriate gate drive circuits to ensure reliable operation.

3. Thermal Management:

   • Ensure adequate cooling to keep the device within its thermal limits, especially during high current or high power dissipation conditions.
   • Use thermal paste or thermal interface materials between the device and the heat sink for better thermal conductivity.

4. Pulse Operation:

   • For pulse applications, ensure that the pulse width and duty cycle are within the specified limits to avoid overheating.

5. Storage:

   • Store the device in a dry, cool place within the specified storage temperature range to prevent damage.

6. Safety Precautions:

   • Follow all safety guidelines and precautions when handling and using the device to prevent electrical shock and other hazards.

(For reference only)