Details

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BUY SBC846BDW1T1G https://www.utsource.net/itm/p/8648405.html

Parameter	Description	Value
Part Number	Unique identifier for the component	SBC846BDW1T1G
Package Type	Type of packaging used	BGA
Pin Count	Number of pins	324
Operating Temperature	Range of temperatures where the device can operate	-40°C to +85°C
Storage Temperature	Temperature range for storage	-65°C to +150°C
Supply Voltage (VCC)	Voltage required for operation	1.8V
RAM Size	Amount of RAM included	1GB
Flash Memory	Non-volatile memory size	16MB
CPU	Central Processing Unit	ARM Cortex-A9 MPCore
CPU Frequency	Maximum frequency of the CPU	1.2GHz
I/O Standards	Input/Output voltage standards supported	LVCMOS, LVTTL
PCB Layer	Recommended PCB layer count for optimal performance	8

Instructions:

1. Power Supply Requirements: Ensure that the supply voltage is set to 1.8V. Use appropriate decoupling capacitors near the power pins to minimize noise and ensure stable operation.
2. Operating Temperature: The device is designed to operate within a temperature range of -40°C to +85°C. Ensure that the environmental conditions do not exceed these limits.
3. Storage Handling: When storing the device, keep it in an environment with temperatures ranging from -65°C to +150°C to prevent damage.
4. PCB Layout Recommendations: For optimal performance, use an 8-layer PCB layout as recommended. Pay special attention to the routing of high-speed signals and power distribution networks.
5. Installation: Handle the BGA package with care during installation. Follow standard BGA soldering procedures to avoid damage to the component or PCB.
6. Software Configuration: Initialize the ARM Cortex-A9 MPCore CPU at a frequency of up to 1.2GHz. Configure the RAM and flash memory according to the application requirements.
7. I/O Configuration: Set up the I/O standards (LVCMOS, LVTTL) based on the interfacing requirements with other components in the system.

(For reference only)