Details

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Parameter Symbol Conditions Min Typ Max Unit
Breakdown Voltage V(BR) I_T = 1 mA 14.0 V
Operating Junction Temp. T_J -55 150 °C
Pulse Power Dissipation P_P t_P = 10 ms, T_A = 25°C 600 W
Reverse Current I_R V_R = 14 V, T_J = 25°C 1.0 μA
Capacitance C f = 1 MHz, V_R = 0 V 130 pF

Instructions for SMBJ14-E3/5B:

  1. Mounting: Ensure the device is mounted on a PCB with adequate clearance to prevent short circuits and ensure proper heat dissipation.
  2. Handling: Use appropriate ESD protection measures during handling and installation to avoid damaging the component.
  3. Soldering: Follow recommended soldering profiles to avoid thermal damage. Peak reflow temperature should not exceed 260°C.
  4. Testing: Test the device under specified conditions (e.g., at room temperature) to ensure it meets the required performance parameters.
  5. Storage: Store in a dry environment to prevent moisture damage. Follow the manufacturer’s guidelines for storage duration and conditions.
(For reference only)

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