SMBJ14-E3/5B
Specifications
Details
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| Parameter | Symbol | Conditions | Min | Typ | Max | Unit |
|---|---|---|---|---|---|---|
| Breakdown Voltage | V(BR) | I_T = 1 mA | 14.0 | V | ||
| Operating Junction Temp. | T_J | -55 | 150 | °C | ||
| Pulse Power Dissipation | P_P | t_P = 10 ms, T_A = 25°C | 600 | W | ||
| Reverse Current | I_R | V_R = 14 V, T_J = 25°C | 1.0 | μA | ||
| Capacitance | C | f = 1 MHz, V_R = 0 V | 130 | pF |
Instructions for SMBJ14-E3/5B:
- Mounting: Ensure the device is mounted on a PCB with adequate clearance to prevent short circuits and ensure proper heat dissipation.
- Handling: Use appropriate ESD protection measures during handling and installation to avoid damaging the component.
- Soldering: Follow recommended soldering profiles to avoid thermal damage. Peak reflow temperature should not exceed 260°C.
- Testing: Test the device under specified conditions (e.g., at room temperature) to ensure it meets the required performance parameters.
- Storage: Store in a dry environment to prevent moisture damage. Follow the manufacturer’s guidelines for storage duration and conditions.
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