Details

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BUY KBPC5010 SEP DIP https://www.utsource.net/itm/p/8909491.html

Parameter	Symbol	Value	Unit
Maximum Repetitive Peak Reverse Voltage	VRRM	50	V
Maximum DC Blocking Voltage	VR	50	V
Maximum RMS Voltage (at T = 25掳C)	VRRMS	35.4	V
Maximum Average Rectified Output Current (T = 25掳C)	IO	10	A
Maximum Average Rectified Output Current (T = 100掳C)	IO(TJ=100掳C)	6.5	A
Maximum Non-Repetitive Peak Surge Current (T = 25掳C, t = 8.3 ms)	IFSM	200	A
Junction Temperature Range	TJ	-55 to 175	掳C
Storage Temperature Range	TSTG	-55 to 150	掳C
Operating Temperature Range	TOPR	-55 to 150	掳C
Forward Voltage Drop (at IF = 10 A)	VF	1.1	V
Reverse Leakage Current (at VR = 50 V, T = 25掳C)	IR	50	渭A
Reverse Recovery Time	trr	50	ns

Instructions for Use:

1. Mounting:

   • Ensure that the component is mounted on a heatsink if continuous operation at high currents is required.
   • Use appropriate mounting hardware to secure the component and ensure good thermal contact with the heatsink.

2. Soldering:

   • Preheat the PCB to reduce thermal shock.
   • Use a soldering iron with a temperature setting between 260掳C and 300掳C.
   • Apply solder to the leads for no more than 10 seconds to avoid damaging the component.

3. Handling:

   • Handle the component by the body, not the leads, to prevent mechanical stress.
   • Store the component in a dry, cool place away from direct sunlight and sources of heat.

4. Electrical Connections:

   • Ensure that the polarity is correct when connecting the diode to the circuit.
   • Use wire gauges suitable for the current ratings to avoid overheating and potential failure.

5. Thermal Management:

   • Monitor the junction temperature to ensure it does not exceed the maximum specified value.
   • If operating at high temperatures, consider using forced air cooling or a larger heatsink.

6. Surge Protection:

   • The diode can handle non-repetitive peak surge currents up to 200 A for short durations (8.3 ms). Ensure that the circuit design accounts for these conditions to prevent damage.

7. Storage:

   • Store the component in a static-protective bag to prevent electrostatic discharge (ESD) damage.

8. Testing:

   • Before installing the component in a final application, test it in a controlled environment to ensure it meets the required specifications.

9. Compliance:

   • Ensure that the component complies with all relevant safety and regulatory standards for your application.

(For reference only)