Details

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BUY FAN7621SSJX https://www.utsource.net/itm/p/8920781.html
IC OFF-LINE CTRLR PROG PFM 16SOP

Parameter	Symbol	Min	Typical	Max	Unit	Conditions
Supply Voltage	Vcc	4.5	-	20	V	-
Quiescent Current	IQ	-	18	-	μA	Vcc = 15V, no load
Output Current (High)	IOH	-	1.5	-	A	Vcc = 15V, Vout = 0.7V
Output Current (Low)	IOL	-	-1.5	-	A	Vcc = 15V, Vout = 14.3V
Propagation Delay Time	tpd	12	-	22	ns	Vcc = 15V, RL = 1kΩ
Rise Time	tr	8	-	15	ns	Vcc = 15V, RL = 1kΩ
Fall Time	tf	8	-	15	ns	Vcc = 15V, RL = 1kΩ
Operating Temperature	Topr	-40	-	125	°C	-
Storage Temperature	Tstg	-65	-	150	°C	-

Instructions for Use:

1. Power Supply:

   • Ensure the supply voltage (Vcc) is within the specified range of 4.5V to 20V.
   • Connect the power supply to the Vcc pin and ground (GND) pin.

2. Quiescent Current:

   • The quiescent current is typically 18 μA at 15V with no load. This value should be considered when designing the power supply circuit to ensure efficient operation.

3. Output Current:

   • The device can source up to 1.5A and sink up to -1.5A. Ensure that the load resistance and voltage levels are within these limits to avoid damage.

4. Propagation Delay:

   • The propagation delay time (tpd) is between 12ns and 22ns at 15V supply voltage. This parameter is crucial for timing considerations in high-speed applications.

5. Rise and Fall Times:

   • The rise time (tr) and fall time (tf) are both between 8ns and 15ns at 15V supply voltage. These values help in determining the switching speed and potential signal integrity issues.

6. Temperature Considerations:

   • The operating temperature range is from -40°C to 125°C. Ensure that the device is used within this range to avoid thermal stress.
   • The storage temperature range is from -65°C to 150°C. Store the device in a suitable environment to prevent damage during storage.

7. Handling:

   • Handle the device with care to avoid static discharge, which can damage sensitive components.
   • Follow proper soldering techniques and use appropriate tools to ensure reliable connections.

8. Testing:

   • Before integrating the device into a final design, perform thorough testing under various conditions to ensure it meets the required performance specifications.

(For reference only)