Details

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BUY ADP191ACBZ-R7 https://www.utsource.net/itm/p/8930806.html
IC CTLR HIGH LSIDE PWR SW 4WLCSP

Parameter	Symbol	Min	Typical	Max	Unit
Input Voltage	VIN	2.65	-	5.5	V
Output Voltage	VOUT	1.0	-	3.3	V
Output Current	IOUT	-	1.5	3.0	A
Quiescent Current	IQ	-	3.0	-	μA
Dropout Voltage	VDROPOUT	-	180	-	mV
PSRR at 1 kHz	PSRR	-	65	-	dB
Load Transient	ΔVOUT/ΔILOAD	-	±20	-	mV
Operating Temperature	TOPR	-40	-	125	°C
Storage Temperature	TSTG	-65	-	150	°C

Instructions for Use:

1. Input Voltage (VIN):

   • Ensure the input voltage is within the range of 2.65V to 5.5V.
   • Connect the input voltage to the VIN pin.

2. Output Voltage (VOUT):

   • Set the output voltage using external resistors or by selecting a fixed output version.
   • The output voltage can be set between 1.0V and 3.3V.

3. Output Current (IOUT):

   • The device can provide up to 3.0A of output current, with a typical value of 1.5A.
   • Ensure the load does not exceed the maximum output current to avoid damage.

4. Quiescent Current (IQ):

   • The quiescent current is typically 3.0μA, which is very low, making it suitable for battery-powered applications.

5. Dropout Voltage (VDROPOUT):

   • The dropout voltage is typically 180mV, allowing the regulator to maintain regulation even when the input voltage is close to the output voltage.

6. Power Supply Rejection Ratio (PSRR):

   • The PSRR at 1kHz is typically 65dB, indicating good noise rejection from the input supply.

7. Load Transient (ΔVOUT/ΔILOAD):

   • The load transient response is typically ±20mV, ensuring stable output voltage during load changes.

8. Operating Temperature (TOPR):

   • The operating temperature range is from -40°C to 125°C. Ensure the device is used within this range to avoid thermal stress.

9. Storage Temperature (TSTG):

   • The storage temperature range is from -65°C to 150°C. Store the device in a dry, cool place to prevent damage.

10. PCB Layout:

    • Use a proper PCB layout with short traces and adequate ground planes to minimize noise and improve performance.
    • Place bypass capacitors close to the input and output pins to filter out high-frequency noise.

11. Thermal Management:

    • If the device is expected to operate at high output currents or in high ambient temperatures, consider adding a heatsink or using a thermal pad to dissipate heat effectively.

(For reference only)