TEA1753LT/N1

TEA1753LT/N1

Category: Transistors

Specifications
Details

BUY TEA1753LT/N1 https://www.utsource.net/itm/p/8941759.html

Parameter Symbol Min Typ Max Unit Description
Input Voltage V_IN 3.5 - 16 V Operating input voltage range
Output Voltage V_OUT - 3.3 - V Regulated output voltage
Quiescent Current I_Q - 10 - μA Supply current in shutdown mode
Load Regulation - - 2 - % Change in output voltage with load
Line Regulation - - 0.5 - % Change in output voltage with input voltage
Dropout Voltage V_DO - 150 - mV Minimum input-output voltage difference for regulation
Power Supply Rejection Ratio PSRR - 70 - dB Attenuation of ripple from input to output
Operating Temperature T_OP -40 - 85 °C Operating ambient temperature range
Storage Temperature T_STG -65 - 150 °C Storage temperature range

Instructions:

  1. Power Supply Connection:

    • Connect the input voltage within the specified range (3.5V to 16V) to the V_IN pin.
    • Ensure proper decoupling capacitors are placed close to the input and output pins to stabilize the voltage.
  2. Output Configuration:

    • The TEA1753LT/N1 provides a fixed 3.3V output. No external components are required for setting the output voltage.
  3. Thermal Considerations:

    • Ensure adequate heat dissipation if operating at high temperatures or under heavy loads.
    • Keep the device within the operating temperature range (-40°C to +85°C).
  4. Shutdown Mode:

    • To enter shutdown mode, pull the SHDN pin low. This reduces the quiescent current to approximately 10μA.
  5. Capacitor Selection:

    • Use ceramic capacitors with X7R dielectric for both input and output filtering. Typical values are 1μF for input and 10μF for output.
  6. PCB Layout:

    • Place the device and its associated components as close together as possible to minimize noise and improve performance.
    • Keep traces short and wide to reduce resistance and inductance.
  7. Handling Precautions:

    • Handle the device with care to avoid damage from electrostatic discharge (ESD).
    • Follow standard precautions for surface-mount technology (SMT) devices during assembly.
  8. Storage:

    • Store the device in a dry environment within the storage temperature range (-65°C to +150°C).
(For reference only)

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