Details

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BUY FGW75N60HD https://www.utsource.net/itm/p/8941827.html

Parameter	Symbol	Value	Unit
Maximum Drain-to-Source Voltage	VDS(max)	600	V
Maximum Gate-to-Source Voltage	VGS(max)	卤20	V
Continuous Drain Current (TC = 25掳C)	ID(25掳C)	75	A
Continuous Drain Current (TC = 100掳C)	ID(100掳C)	55	A
Pulse Drain Current (TC = 25掳C, 10 ms, 1% Duty Cycle)	IDpeak(25掳C)	225	A
Power Dissipation (TC = 25掳C)	PD(25掳C)	375	W
Junction Temperature Range	TJ	-55 to +175	掳C
Storage Temperature Range	TSTG	-55 to +175	掳C
Total Device Dissipation (TA = 25掳C)	PTOT(25掳C)	375	W
Thermal Resistance, Junction to Case	RthJC	0.5	掳C/W
Thermal Resistance, Junction to Ambient	RthJA	40	掳C/W

Instructions for Use:

1. Mounting and Handling:

   • Ensure that the device is mounted on a heatsink with adequate thermal conductivity to maintain junction temperature within safe limits.
   • Use proper handling techniques to avoid damage to the device, especially during soldering.

2. Electrical Connections:

   • Connect the drain, source, and gate terminals correctly to avoid short circuits or incorrect biasing.
   • Use short leads and wide traces to minimize inductance and resistance in the circuit.

3. Gate Drive:

   • Apply a gate voltage (V_GS) between 10V and 15V for optimal performance.
   • Ensure that the gate drive circuit can provide sufficient current to charge and discharge the gate capacitance quickly.

4. Thermal Management:

   • Monitor the junction temperature (T_J) to ensure it does not exceed 175掳C.
   • Use thermal paste or thermal interface materials to enhance heat transfer from the device to the heatsink.

5. Overcurrent Protection:

   • Implement overcurrent protection to prevent damage due to excessive current.
   • Consider using a current-limiting resistor or a fuse in series with the drain.

6. Storage and Transportation:

   • Store the device in a dry, cool place away from direct sunlight.
   • Handle the device with care to avoid mechanical stress or damage.

7. Testing:

   • Before final assembly, test the device under controlled conditions to ensure it meets the specified parameters.
   • Use appropriate test equipment and procedures to avoid damaging the device.

8. Compliance:

   • Ensure that the device complies with all relevant safety and regulatory standards for your application.

(For reference only)