Details

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BUY W9825G6KH-6 https://www.utsource.net/itm/p/8954554.html
IC DRAM 256M PARALLEL 54TSOP

Parameter	Value
Device Type	3V SDRAM
Density	256 Mbit (32 M x 8)
Organization	x8
Supply Voltage (Vcc)	3.3V ± 0.3V
Operating Temperature	-40°C to +85°C
Data Rate	133 MHz (PC133)
Package Type	54-pin TSOP II
Access Time	7.5 ns
Refresh Cycle	8.5 ns
CL (CAS Latency)	2, 3
RAS# to CAS# Delay (tRCD)	2, 3 cycles
Row Precharge Time (tRP)	2, 3 cycles
Row Active Time (tRAS)	5, 6 cycles
Self Refresh Exit Time	70 ns
Power Down Exit Time	70 ns
Standby Current	20 mA (max)
Active Current	100 mA (max)

Instructions for Use:

1. Power Supply:

   • Ensure the supply voltage is within the specified range of 3.3V ± 0.3V.
   • Use appropriate decoupling capacitors to stabilize the power supply.

2. Temperature Range:

   • Operate the device within the temperature range of -40°C to +85°C to ensure reliable performance.

3. Data Rate:

   • The device supports a data rate of 133 MHz, compatible with PC133 standards.

4. Timing Parameters:

   • Set the timing parameters according to the values provided in the table to avoid data corruption or loss.
   • For example, set the CAS Latency (CL) to 2 or 3, RAS# to CAS# Delay (tRCD) to 2 or 3 cycles, etc.

5. Refresh:

   • Implement the refresh cycle as specified to prevent data loss. The refresh cycle should be 8.5 ns.

6. Power Management:

   • Use the self-refresh and power-down modes to reduce power consumption during idle periods.
   • Ensure that the exit times for these modes are respected to avoid data corruption.

7. Signal Integrity:

   • Use proper termination and routing techniques to minimize signal reflections and crosstalk, especially for high-speed signals.

8. Storage and Handling:

   • Store the device in a dry, static-free environment.
   • Handle the device with care to avoid damage to the pins and package.

9. Testing:

   • Before integrating the device into a system, perform thorough testing to ensure it meets the required specifications and operates correctly.

10. Documentation:

    • Refer to the datasheet and application notes for more detailed information and specific use cases.

(For reference only)