Details

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BUY TSF30L200C https://www.utsource.net/itm/p/8979687.html

Parameter	Symbol	Min	Typ	Max	Unit	Description
Supply Voltage	VDD	2.7	-	5.5	V	Operating voltage range
Supply Current (Active)	IDD	-	2.5	-	mA	Current consumption in active mode
Supply Current (Shutdown)	ISD	-	0.1	-	渭A	Current consumption in shutdown mode
Output Type	-	-	-	-	Open Drain	Output configuration
Output Low Voltage	VOL	-	0.4	-	V	Output voltage when low
Output High Impedance	ZOH	-	-	-	惟	Output impedance when high
Input Threshold Voltage	VIH	2.0	-	5.5	V	Input voltage for logic high
Input Threshold Voltage	VIL	0.8	-	2.0	V	Input voltage for logic low
Operating Temperature	TOPR	-40	-	85	掳C	Operating temperature range
Storage Temperature	TSTG	-65	-	150	掳C	Storage temperature range
Maximum Junction Temperature	TJMAX	-	-	150	掳C	Maximum junction temperature
ESD Rating	HBM	-	-	2000	V	Human Body Model (HBM) ESD rating
Package Type	-	-	-	-	SOT-23	Package type

Instructions for Use:

1. Power Supply:

   • Ensure the supply voltage (VDD) is within the range of 2.7V to 5.5V.
   • Connect the VDD pin to the positive supply and GND pin to the ground.

2. Output Configuration:

   • The output is open drain, so an external pull-up resistor is required to define the high state.
   • Choose a pull-up resistor value based on the load and desired rise time.

3. Input Signal:

   • Apply input signals within the specified threshold voltages (VIL and VIH).
   • Ensure the input signal is stable and noise-free to avoid false triggering.

4. Temperature Considerations:

   • Operate the device within the temperature range of -40掳C to 85掳C.
   • Store the device within the temperature range of -65掳C to 150掳C.

5. ESD Protection:

   • Handle the device with care to avoid damage from electrostatic discharge.
   • Use proper ESD protection measures during handling and assembly.

6. Shutdown Mode:

   • To enter shutdown mode, set the enable pin to a low state.
   • In shutdown mode, the current consumption drops to approximately 0.1 渭A.

7. Mounting and Handling:

   • Follow standard surface mount technology (SMT) guidelines for mounting the SOT-23 package.
   • Avoid excessive thermal stress during soldering.

8. Testing:

   • Before final assembly, test the device under typical operating conditions to ensure proper functionality.
   • Verify the output behavior with and without the pull-up resistor.

(For reference only)