NTH0512MC
Specifications
Details
BUY NTH0512MC https://www.utsource.net/itm/p/8980979.html
| Parameter | Symbol | Conditions | Min | Typ | Max | Unit |
|---|---|---|---|---|---|---|
| Rated Voltage | VR | Continuous | - | 50 | - | Vdc |
| Peak Current | IPK | Pulse Width ≤ 1ms | - | 2.0 | - | A |
| Continuous Current | IC | @ TA = 25°C | - | 0.5 | - | A |
| Power Dissipation | PD | @ TA = 25°C | - | 0.625 | - | W |
| Junction Temperature | TJ | Operating | -55 | - | 150 | °C |
| Storage Temperature | TSTG | -55 | - | 150 | °C | |
| Thermal Resistance | RθJA | Junction to Ambient | - | 200 | - | °C/W |
Instructions for Use:
- Mounting: Ensure the NTH0512MC is mounted on a suitable heatsink if operating near its maximum power dissipation limits to maintain junction temperature within specified limits.
- Voltage Handling: Do not exceed the rated voltage of 50Vdc continuously to avoid damage to the component.
- Current Limitations: For continuous operation, do not exceed the continuous current rating of 0.5A at an ambient temperature of 25°C. For pulse applications, ensure pulse width does not exceed 1ms and peak current does not exceed 2.0A.
- Temperature Management: Keep the junction temperature between -55°C and 150°C. Monitor the ambient and operating temperatures closely.
- Storage Conditions: Store the component in environments where the temperature ranges from -55°C to 150°C to ensure longevity and performance integrity.
- Thermal Considerations: The thermal resistance (RθJA) is 200°C/W. Design the application to manage heat effectively, especially in high-power or high-temperature environments.
View more about NTH0512MC on main site
