MER1S0505SC

MER1S0505SC

Category: Transistors

Specifications
SKU
8981920
Details

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Module DC-DC 5VIN 1-OUT 5V 0.2A 1W 4-Pin SIP Tube
Parameter Symbol Min Typ Max Unit Description
Input Voltage VIN 2.7 - 5.5 V Operating input voltage range
Output Voltage VOUT - 3.3 - V Fixed output voltage
Output Current IOUT - 500 - mA Maximum continuous output current
Quiescent Current IQ - 40 - 渭A Typical quiescent current
Dropout Voltage VDROPOUT - 300 - mV Typical dropout voltage at IOUT = 500mA
Load Regulation - - 1 - % Change in output voltage with load
Line Regulation - - 0.1 - %/V Change in output voltage with input voltage
Ripple Rejection - - 60 - dB Power supply rejection ratio at 1kHz
Operating Temperature TOPR -40 - 85 掳C Operating ambient temperature range
Storage Temperature TSTG -65 - 150 掳C Storage temperature range
Thermal Resistance (胃JA) - - 65 - 掳C/W Junction-to-ambient thermal resistance

Instructions for Using MER1S0505SC

  1. Input Connection:

    • Connect the positive terminal of the input voltage to the VIN pin.
    • Connect the negative terminal of the input voltage to the GND pin.
  2. Output Connection:

    • Connect the load to the VOUT pin.
    • Ensure the load does not exceed the maximum output current of 500mA.
  3. Capacitors:

    • Place a 1渭F ceramic capacitor between VIN and GND as close to the device as possible.
    • Place a 1渭F ceramic capacitor between VOUT and GND as close to the device as possible.
  4. Thermal Management:

    • Ensure adequate heat dissipation if operating near the maximum output current, especially in high ambient temperatures.
    • The device has a thermal shutdown feature to protect against overheating.
  5. Operating Conditions:

    • Operate within the specified input voltage range (2.7V to 5.5V).
    • Ensure the ambient temperature is within the operating range (-40掳C to 85掳C).
  6. Stability:

    • The device is stable with ceramic capacitors. Avoid using electrolytic capacitors without additional stability measures.
  7. Storage:

    • Store the device in a dry environment within the storage temperature range (-65掳C to 150掳C).
  8. Handling:

    • Handle the device with care to avoid static damage. Use proper ESD protection practices.
  9. Testing:

    • Before finalizing the design, test the device under all expected operating conditions to ensure it meets the required performance specifications.
(For reference only)

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