H11F1S
Specifications
SKU
9254293
Details
BUY H11F1S https://www.utsource.net/itm/p/9254293.html
| Parameter | Symbol | Min | Typ | Max | Unit | Description |
|---|---|---|---|---|---|---|
| Forward Voltage | VF | - | 1.2 | 1.5 | V | Voltage at which the device conducts forward current |
| Forward Current | IF | - | 10 | 30 | mA | Maximum continuous forward current |
| Reverse Voltage | VR | - | - | 5 | V | Maximum reverse voltage |
| Reverse Current | IR | - | 1 | 5 | 渭A | Leakage current at maximum reverse voltage |
| Isolation Voltage | VISO | - | - | 2500 | Vrms | Voltage isolation between input and output |
| Operating Temperature | TOP | -40 | - | 105 | 掳C | Temperature range for normal operation |
| Storage Temperature | TSTG | -55 | - | 150 | 掳C | Temperature range for storage |
Instructions:
Forward Biasing:
- Ensure that the forward voltage (VF) is within the specified range to avoid damage.
- Do not exceed the maximum forward current (IF) to prevent overheating and potential failure.
Reverse Biasing:
- The device should not be subjected to a reverse voltage (VR) higher than the maximum specified to avoid breakdown.
Isolation:
- Maintain the isolation voltage (VISO) to ensure safe electrical isolation between the input and output circuits.
Temperature:
- Operate the device within the specified operating temperature (TOP) range to ensure reliable performance.
- Store the device within the storage temperature (TSTG) range to prevent damage during non-operational periods.
Handling:
- Handle the device with care to avoid mechanical stress and electrostatic discharge (ESD) damage.
- Use appropriate ESD protection measures when handling or soldering the device.
Mounting:
- Follow recommended soldering profiles and temperatures to avoid thermal shock and ensure proper solder joint formation.
- Ensure adequate cooling if the device will be operated at high current levels.
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