Details

---

BUY TLP291(GB-TP,SE(T https://www.utsource.net/itm/p/9267309.html
Original and Stock

Parameter	Symbol	Min	Typ	Max	Unit	Condition
Forward Voltage (VF)	VF	-	1.2	1.5	V	IF = 10 mA
Reverse Voltage (VR)	VR	-	-	5.0	V	IR = 5 μA
Continuous Forward Current (IF)	IF	-	-	50	mA	TA = 25°C
Peak Forward Current (IF(surge))	IF(surge)	-	-	1.0	A	tp = 10 ms, fr = 1 Hz
Output Collector-Emitter Saturation Voltage (VCE(sat))	VCE(sat)	-	0.45	0.6	V	IC = 50 mA, VCE = 5 V
Output Collector Current (IC)	IC	-	-	50	mA	VCE = 5 V
Output Turn-On Time (ton)	ton	-	2.0	5.0	μs	IF = 10 mA, RL = 100 Ω, VCC = 5 V
Output Turn-Off Time (toff)	toff	-	2.0	5.0	μs	IF = 10 mA, RL = 100 Ω, VCC = 5 V
Isolation Voltage (VI)	VI	-	-	3750	Vrms	1 min, 50/60 Hz
Operating Temperature Range (Top)	Top	-40	-	110	°C	-
Storage Temperature Range (Tstg)	Tstg	-40	-	125	°C	-

Instructions for Use:

1. Power Supply:

   • Ensure the supply voltage is within the specified range to avoid damage.
   • Use appropriate decoupling capacitors near the power supply pins to minimize noise.

2. Current Limiting:

   • Use a current-limiting resistor in series with the input LED to ensure the forward current (I_F) does not exceed 50 mA.
   • For peak currents, ensure that the pulse duration and repetition rate are within the specified limits to prevent overheating.

3. Output Circuit:

   • The output transistor can handle up to 50 mA continuously. Ensure the load resistance is appropriate to keep the collector current within this limit.
   • Use a flyback diode across inductive loads to protect the output transistor from voltage spikes.

4. Isolation:

   • The device provides high isolation voltage (3750 V_rms). Ensure that the input and output circuits are properly isolated to maintain safety and performance.

5. Temperature Considerations:

   • Operate the device within the specified temperature range to ensure reliable operation.
   • Provide adequate cooling if the device is expected to operate at high temperatures or in high-power applications.

6. Handling:

   • Handle the device with care to avoid static damage.
   • Follow proper soldering techniques to avoid thermal stress on the device.

7. Testing:

   • Test the device under controlled conditions to verify its performance before integrating it into a larger system.

(For reference only)