Details

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BUY MP1593DN-LF-Z SOP-8 https://www.utsource.net/itm/p/9272345.html

Parameter	Symbol	Min	Typ	Max	Unit	Description
Input Voltage	VIN	2.7	-	5.5	V	Operating input voltage range
Output Voltage	VOUT	-	1.2	-	V	Fixed output voltage
Output Current	IOUT	-	3.0	-	A	Continuous output current
Quiescent Current	IQ	-	25	-	μA	Supply current at no load
Dropout Voltage	VD	-	1.2	-	V	Maximum dropout voltage at full load
Power Dissipation	PD	-	-	1.5	W	Maximum power dissipation (TA = 25°C)
Operating Temperature	TOPR	-40	-	125	°C	Operating ambient temperature range
Storage Temperature	TSTG	-65	-	150	°C	Storage temperature range
Thermal Resistance (θJA)	θJA	-	50	-	°C/W	Junction-to-ambient thermal resistance

Instructions for Use:

1. Input Voltage:

   • Ensure the input voltage is within the specified range of 2.7V to 5.5V to avoid damage to the device.

2. Output Voltage:

   • The output voltage is fixed at 1.2V. No external resistors are required for setting the output voltage.

3. Output Current:

   • The device can provide a continuous output current of up to 3.0A. Ensure the load does not exceed this limit to prevent overheating or damage.

4. Quiescent Current:

   • The quiescent current is typically 25μA. This low current consumption makes the device suitable for battery-powered applications.

5. Dropout Voltage:

   • The maximum dropout voltage is 1.2V. This means the input voltage must be at least 1.2V higher than the output voltage to maintain regulation.

6. Power Dissipation:

   • The maximum power dissipation is 1.5W at an ambient temperature of 25°C. Ensure adequate heat sinking if operating near this limit.

7. Operating Temperature:

   • The device is rated to operate from -40°C to 125°C. Avoid operating outside this range to ensure reliable performance.

8. Storage Temperature:

   • Store the device in an environment with temperatures ranging from -65°C to 150°C to prevent damage.

9. Thermal Resistance:

   • The junction-to-ambient thermal resistance is 50°C/W. Use appropriate heatsinking to manage thermal dissipation, especially under high load conditions.

10. Mounting:

    • Mount the device on a PCB with proper thermal management techniques, such as using a ground plane and thermal vias, to enhance heat dissipation.

11. Capacitors:

    • Use input and output capacitors as recommended in the datasheet to ensure stability and reduce noise. Typical values are 10μF for both input and output.

12. PCB Layout:

    • Follow good PCB layout practices to minimize parasitic inductance and capacitance, which can affect the performance of the regulator.

13. Handling:

    • Handle the device with care to avoid static discharge and physical damage. Use ESD protection when handling the device.

(For reference only)