Details

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BUY MMSZ5231BT1G SOD123 https://www.utsource.net/itm/p/9275091.html

Parameter	Symbol	Test Conditions	Min	Typ	Max	Unit
Reverse Voltage	VR				30	V
Reverse Current	IR	VR = 30V		5		μA
Forward Voltage	VF	IF = 5mA	1.42		1.60	V
Peak Pulse Current	Ipp	tpp = 10ms, Rep Rate 1/s		0.5		A
Operating Temperature	Topr		-65		+150	°C
Storage Temperature	Tstg		-65		+150	°C

Instructions for MMSZ5231BT1G SOD123:

1. Handling Care: Use appropriate handling techniques to avoid damage from electrostatic discharge (ESD). The device is sensitive to ESD and should be handled with care.
2. Mounting Orientation: Ensure correct orientation during mounting to prevent reverse polarity which can lead to device failure.
3. Soldering Temperature: Do not exceed a soldering temperature of 260°C for more than 10 seconds to avoid thermal damage.
4. Storage Conditions: Store in a dry environment within the specified storage temperature range to maintain reliability.
5. Reverse Voltage Application: Do not apply reverse voltage exceeding the maximum rated value to prevent breakdown or permanent damage.
6. Forward Current Limitation: Operate within the forward current limits to avoid overheating and potential damage.
7. Pulse Current Handling: Be cautious with pulse currents; ensure they do not exceed the peak pulse current rating to prevent premature failure.
8. Thermal Management: Provide adequate heat sinking if operating at high temperatures or currents to ensure long-term reliability.

(For reference only)