Details

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BUY OB2223SP https://www.utsource.net/itm/p/9460372.html

Parameter	Symbol	Min	Typical	Max	Unit	Notes
Supply Voltage	Vcc	4.5	-	5.5	V	Operating voltage range
Standby Current	Isb	-	0.1	-	渭A	Current consumption in standby mode
Output Current (Sink)	IOL	-	20	-	mA	Maximum output current when sinking
Output Current (Source)	IOH	-	10	-	mA	Maximum output current when sourcing
Input Voltage (High)	VIH	-	3.5	-	V	Minimum input voltage for high logic level
Input Voltage (Low)	VIL	-	1.5	-	V	Maximum input voltage for low logic level
Propagation Delay Time	tpd	-	10	-	ns	Time delay from input to output
Storage Temperature	Tstg	-40	-	85	掳C	Temperature range for storage
Operating Temperature	Topr	-40	-	85	掳C	Temperature range for operation

Instructions for Use

1. Power Supply:

   • Ensure the supply voltage (Vcc) is within the specified range of 4.5V to 5.5V.
   • Connect the Vcc pin to a stable power source.

2. Standby Mode:

   • The device consumes approximately 0.1 渭A in standby mode. Ensure that the input signals are properly managed to avoid unnecessary power consumption.

3. Output Current:

   • The device can sink up to 20 mA and source up to 10 mA. Design your circuit to stay within these limits to avoid damage.

4. Input Logic Levels:

   • For a high logic level, the input voltage (VIH) should be at least 3.5V.
   • For a low logic level, the input voltage (VIL) should not exceed 1.5V.

5. Propagation Delay:

   • The typical propagation delay time (tpd) is 10 ns. This is the time it takes for the output to respond to a change in the input signal.

6. Temperature Considerations:

   • The device can operate within a temperature range of -40掳C to 85掳C.
   • Store the device in a temperature range of -40掳C to 85掳C to ensure long-term reliability.

7. Handling:

   • Handle the device with care to avoid static discharge, which can damage the internal components.
   • Follow proper ESD (Electrostatic Discharge) precautions during handling and installation.

8. Mounting:

   • Ensure proper soldering techniques are used to avoid thermal shock and mechanical stress.
   • Use a heat sink if necessary to manage thermal dissipation, especially in high-current applications.

9. Testing:

   • Before finalizing the design, test the device under various operating conditions to ensure it meets the required specifications.

10. Compliance:

    • Ensure that the device complies with all relevant safety and regulatory standards for your application.

(For reference only)