Details

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BUY UPD720150GK-9EU-A https://www.utsource.net/itm/p/9468510.html

Parameter	Description	Value	Unit
Package	Type of package	LQFP-64	-
Operating Temperature Range	Temperature range for operation	-40 to +85	°C
Supply Voltage (VCC)	Operating voltage range	3.0 to 3.6	V
Data Rate	Maximum data transfer rate	12	Mbps
Interface	Communication interface type	USB 2.0 Full-Speed	-
Integrated Controller	Type of integrated controller	USB 2.0 Full-Speed Host/Peripheral Controller	-
GPIO Pins	Number of General Purpose Input/Output pins	16	-
Program Memory	Size of program memory	32	KB
Data Memory	Size of data memory	2	KB
EEPROM	Size of EEPROM	2	KB
Clock Frequency	Internal oscillator frequency	12	MHz
Power Consumption (Active Mode)	Power consumption in active mode	150	mA
Power Consumption (Sleep Mode)	Power consumption in sleep mode	1	μA
ESD Protection	Electrostatic discharge protection level	±2	kV
Package Dimensions	Physical dimensions of the package	10 x 10 x 1.4	mm

Instructions:

1. Power Supply:

   • Ensure the supply voltage (VCC) is within the specified range of 3.0 to 3.6V.
   • Use appropriate decoupling capacitors (e.g., 0.1μF and 10μF) close to the power pins to stabilize the supply voltage.

2. Clock Configuration:

   • The internal oscillator operates at 12 MHz. If an external clock source is used, ensure it is stable and within the operating frequency range.

3. GPIO Configuration:

   • Configure the GPIO pins as required for your application. Refer to the datasheet for specific pin functions and configurations.

4. USB Interface:

   • Connect the USB D+ and D- lines to the corresponding pins on the device.
   • Ensure proper termination and shielding for USB signals to minimize noise and interference.

5. Memory Management:

   • Program memory (32KB) and data memory (2KB) should be managed according to the application requirements.
   • Use the integrated EEPROM (2KB) for storing non-volatile data.

6. Power Management:

   • To reduce power consumption, use the sleep mode when the device is idle.
   • Monitor the power consumption in active and sleep modes to optimize battery life if applicable.

7. ESD Protection:

   • Handle the device with care to avoid ESD damage.
   • Use ESD-protected workstations and tools during handling and assembly.

8. Thermal Considerations:

   • Ensure adequate heat dissipation for the package, especially in high-temperature environments.
   • Use thermal vias and a heatsink if necessary to maintain the operating temperature within the specified range.

For detailed information, refer to the datasheet and application notes provided by the manufacturer.

(For reference only)