Details

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Parameter	Symbol	Min	Typ	Max	Unit	Description
Average Rectified Current (Non-repetitive)	IF(AV)	-	4.0	-	A	Non-repetitive average rectified current at T_A = 25°C, f = 50/60 Hz, C_L ≤ 1 μF
Peak Repetitive Reverse Voltage	V_RRM	-	600	-	V	Peak repetitive reverse voltage at I_RM = 0, T_J = 25°C
Maximum RMS Voltage	V_RM	-	424	-	V	Maximum RMS voltage at T_J = 25°C
Forward Voltage Drop	V_F	-	1.1	-	V	Forward voltage drop at I_F = 4.0 A, T_J = 25°C
Reverse Recovery Time	t_rr	-	35	-	ns	Reverse recovery time at I_F = 4.0 A, I_RRM = 200 mA, T_J = 25°C
Junction Temperature	T_J	-	-	150	°C	Maximum junction temperature
Storage Temperature	T_STG	-40	-	150	°C	Operating storage temperature range

Instructions for Use:

1. Mounting:

   • Ensure proper heat sinking to maintain T_J within specified limits.
   • Use recommended PCB layout to minimize parasitic inductance.

2. Handling:

   • Handle with care to avoid mechanical stress.
   • Follow ESD (Electrostatic Discharge) precautions to prevent damage.

3. Operating Conditions:

   • Do not exceed the maximum ratings listed in the table.
   • Ensure adequate cooling for continuous operation at high currents.

4. Testing:

   • Test the device under conditions similar to those listed in the parameter table to ensure reliable performance.
   • Use appropriate test equipment and procedures to avoid damaging the device.

5. Storage:

   • Store in a dry, cool place away from direct sunlight.
   • Keep in original packaging until ready for use to protect against moisture and static.

6. Soldering:

   • Use a soldering temperature of 260°C for no more than 10 seconds.
   • Allow the device to cool naturally after soldering to prevent thermal shock.

7. Derating:

   • Derate the forward current as per the derating curve provided in the datasheet for temperatures above 25°C.

(For reference only)