Details

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BUY EP2C5Q208C8N EP2C5Q208C8 QFP208 https://www.utsource.net/itm/p/9477124.html

Parameter	Description	Value
Device	Device Name	EP2C5Q208C8N
Package	Package Type	QFP208
Pin Count	Number of Pins	208
Operating Temperature	Operating Temperature Range	-40掳C to +85掳C
Supply Voltage (VCC)	Core Supply Voltage	1.2V
I/O Voltage (VCCIO)	I/O Supply Voltage	1.5V, 1.8V, 2.5V, 3.3V
Configuration Voltage (VCCCONF)	Configuration Supply Voltage	1.8V, 2.5V, 3.3V
Configuration Mode	Configuration Modes	Active Serial, Passive Serial, JTAG, AS+PS, AS+JTAG, PS+JTAG
Clock Frequency	Maximum Clock Frequency	275 MHz
Logic Cells	Number of Logic Cells	5,000
RAM Blocks	Number of RAM Blocks	56
Multiplier Blocks	Number of Multiplier Blocks	8
I/O Banks	Number of I/O Banks	14
I/O Standards	Supported I/O Standards	LVCMOS15, LVCMOS18, LVCMOS25, LVCMOS33, SSTL-2, SSTL-3, HSTL, PCI, PCIX, LVDS, RSDS
Configuration Memory	Configuration Memory Size	1.5 Mb
Package Pitch	Pin Pitch	0.5 mm
Package Dimensions	Body Dimensions	20 mm x 20 mm
Thermal Resistance (胃JA)	Junction-to-Ambient Thermal Resistance	29.5掳C/W

Instructions for Use:

1. Power Supply Connections:

   • Connect VCC (1.2V) to the core power supply.
   • Connect VCCIO to the appropriate I/O voltage level (1.5V, 1.8V, 2.5V, or 3.3V).
   • Connect VCCCONF to the configuration supply voltage (1.8V, 2.5V, or 3.3V).

2. Configuration:

   • Ensure that the configuration mode is set correctly using the appropriate pins.
   • Use the selected configuration method (Active Serial, Passive Serial, JTAG, etc.) to load the bitstream.

3. Clocking:

   • Connect the clock signal to the appropriate clock input pin.
   • Ensure the clock frequency does not exceed the maximum specified value (275 MHz).

4. I/O Usage:

   • Configure the I/O standards as required for your application.
   • Ensure that the I/O banks are powered correctly according to the selected I/O standard.

5. Thermal Management:

   • Ensure adequate cooling to keep the junction temperature within the operating range.
   • Use a heatsink if necessary, especially in high-power applications.

6. Handling:

   • Handle the device with care to avoid damage to the pins.
   • Follow ESD (Electrostatic Discharge) precautions to prevent damage to the device.

7. Storage:

   • Store the device in a dry, cool environment to prevent moisture damage.
   • Follow recommended storage guidelines to ensure long-term reliability.

(For reference only)