Details

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BUY FA8A00 https://www.utsource.net/itm/p/9477394.html

Parameter	Description	Value
Part Number	Full part number	FA8A00
Type	Type of device	MOSFET Driver
Package	Package type	SOIC-8
Operating Voltage (Vcc)	Supply voltage range	4.5V to 20V
Input Voltage (VIN)	Input voltage range	0V to Vcc
Output Current (Iout)	Maximum output current per channel	卤1.5A
Operating Temperature (Tamb)	Ambient temperature range	-40掳C to 85掳C
Storage Temperature (Tstg)	Storage temperature range	-65掳C to 150掳C
Propagation Delay (tpd)	Propagation delay time	70ns (typ)
Rise Time (tr)	Rise time	20ns (typ)
Fall Time (tf)	Fall time	20ns (typ)
Quiescent Current (IQ)	Quiescent current at Vcc = 15V, no load	1.5mA (max)
Input Capacitance (Cin)	Input capacitance at Vcc = 15V	10pF (max)
Output Capacitance (Cout)	Output capacitance at Vcc = 15V	10pF (max)
Short-Circuit Protection	Protection against short-circuit conditions	Yes
Thermal Shutdown	Protection against overtemperature conditions	Yes

Instructions for Use

1. Power Supply Connection:

   • Connect the supply voltage (Vcc) to the Vcc pin.
   • Ground (GND) must be connected to the ground pin.

2. Input Signal:

   • Apply the input signal (VIN) to the appropriate input pins.
   • Ensure the input voltage is within the specified range (0V to Vcc).

3. Output Configuration:

   • The output pins can drive MOSFETs or other loads directly.
   • Ensure the load current does not exceed the maximum output current (卤1.5A).

4. Thermal Management:

   • Ensure adequate heat dissipation to prevent overheating.
   • Use a heatsink if necessary, especially under high current conditions.

5. Protection Features:

   • The device includes short-circuit protection and thermal shutdown.
   • These features will automatically activate if the device detects a fault condition.

6. Storage and Handling:

   • Store the device in a dry, cool place within the specified storage temperature range.
   • Handle with care to avoid damage from electrostatic discharge (ESD).

7. Soldering:

   • Use a soldering iron with a temperature setting suitable for the SOIC-8 package.
   • Avoid excessive heat and mechanical stress during soldering.

8. Testing:

   • After assembly, test the device under typical operating conditions to ensure proper functionality.
   • Verify the output signals and current levels to confirm correct operation.

(For reference only)