Details

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BUY SX1308 B628 https://www.utsource.net/itm/p/9494823.html

Parameter	Description	Value	Unit
Part Number	Device Identifier	SX1308 B628	-
Function	Device Type	Low-Noise Amplifier (LNA)	-
Frequency Range	Operating Frequency	700 to 960	MHz
Gain	Signal Gain	18.5	dB
Noise Figure	Noise Performance	1.2	dB
Input IP3	Third-Order Intermodulation Intercept Point	14	dBm
Input Return Loss	Reflection Loss at Input	12	dB
Output Return Loss	Reflection Loss at Output	12	dB
Supply Voltage	Operating Voltage	2.7 to 5.5	V
Current Consumption	Power Consumption	11	mA
Operating Temperature	Temperature Range	-40 to +85	掳C
Package Type	Physical Package	QFN-8	-
Pin Count	Number of Pins	8	-

Instructions for Use

1. Power Supply:

   • Connect the supply voltage (Vcc) between 2.7V and 5.5V to the Vcc pin.
   • Ensure a stable and clean power supply to avoid noise and instability.

2. Biasing:

   • The LNA is internally biased, so no external biasing components are required.
   • However, ensure that the supply voltage is within the specified range to maintain optimal performance.

3. Input and Output Matching:

   • Match the input and output impedances to 50 ohms for best performance.
   • Use appropriate matching networks if the connected circuits have different impedances.

4. Grounding:

   • Connect the ground (GND) pin to a low-impedance ground plane to minimize noise and improve stability.
   • Ensure proper grounding to avoid common-mode noise and interference.

5. Decoupling Capacitors:

   • Place a 0.1 渭F decoupling capacitor close to the Vcc pin to filter out high-frequency noise.
   • Optionally, add a 10 渭F capacitor for additional filtering.

6. Signal Path:

   • Connect the RF input signal to the IN pin and the RF output signal to the OUT pin.
   • Ensure that the signal path is as short as possible to minimize loss and interference.

7. Temperature Considerations:

   • Operate the device within the temperature range of -40掳C to +85掳C to ensure reliable performance.
   • Avoid exposing the device to extreme temperatures or rapid temperature changes.

8. Handling Precautions:

   • Handle the device with care to avoid static discharge, which can damage the sensitive components.
   • Use proper ESD protection when handling and soldering the device.

9. Soldering:

   • Use a temperature-controlled soldering iron and follow standard reflow soldering profiles.
   • Ensure that the solder joints are clean and free of voids to maintain good electrical connections.

10. Testing:

    • After assembly, test the device using a signal generator and spectrum analyzer to verify gain, noise figure, and other performance parameters.
    • Compare the measured values with the datasheet specifications to ensure proper operation.

(For reference only)