Details

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BUY TLP626(TP1,F) https://www.utsource.net/itm/p/9502253.html

Parameter	Symbol	Conditions	Min	Typ	Max	Unit
Forward Voltage	VF	IF = 5 mA		1.2	1.6	V
Forward Current	IF			5	30	mA
Peak Pulse Current	IFT	tp = 1 ms		100		mA
Reverse Voltage	VR			5	7	V
Reverse Current	IR	VR = 5 V		100		渭A
Output Current	IO	VI = 4.5 V, VO = 3 V		20	40	mA
Turn-On Time	ton	IF = 5 mA, RL = 100 惟		0.8	2.0	渭s
Turn-Off Time	toff	IF = 5 mA, RL = 100 惟		0.8	2.0	渭s

Instructions for TLP626(TP1,F):

1. Mounting Orientation: Ensure the device is mounted with proper orientation as indicated by the pin configuration and marking on the package.

2. Soldering Temperature: Keep soldering temperature within the range of 260掳C for no more than 10 seconds to avoid damaging the device.

3. Electrostatic Discharge (ESD) Protection: Handle the device with appropriate ESD precautions to prevent damage from static electricity.

4. Operating Environment: Ensure that the operating environment does not exceed the maximum ambient temperature specified in the datasheet.

5. Power Supply Considerations: Verify that the power supply voltage and current ratings are within the specified limits to ensure reliable operation.

6. Signal Integrity: Maintain good signal integrity by minimizing noise and interference in the circuit layout, especially for high-frequency applications.

7. Heat Dissipation: If the device will be operating near its maximum current or voltage ratings, consider adding heat sinks or other cooling methods to manage heat dissipation effectively.

8. Testing: Before final assembly, test the device under typical operating conditions to ensure it meets performance specifications.

9. Storage: Store the device in a dry, cool place away from direct sunlight and sources of heat.

10. Compliance: Ensure all applications comply with relevant safety and regulatory standards.

(For reference only)