PS2571-1-A
Specifications
SKU
9506917
Details
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| Parameter | Symbol | Min | Typ | Max | Unit | Description |
|---|---|---|---|---|---|---|
| Input Voltage | VIN | 4.5 | - | 40 | V | Operating input voltage range |
| Output Voltage | VOUT | - | 3.3 | - | V | Fixed output voltage |
| Output Current | IOUT | - | 1 | 1.5 | A | Continuous output current |
| Quiescent Current | IQ | - | 2.5 | 5 | 渭A | Typical quiescent current |
| Dropout Voltage | VDROPOUT | - | 0.6 | 1.2 | V | Dropout voltage at 1A |
| Load Regulation | - | - | 1 | 2 | % | Change in output voltage with load |
| Line Regulation | - | - | 0.1 | 0.2 | %/V | Change in output voltage with input |
| Ripple Rejection | - | 60 | 70 | 80 | dB | Attenuation of input ripple |
| Operating Temperature | TOPR | -40 | - | 125 | 掳C | Operating temperature range |
| Storage Temperature | TSTG | -65 | - | 150 | 掳C | Storage temperature range |
| Package | - | - | - | - | TO-252 | Package type |
Instructions for Use:
- Input Connection: Connect the input voltage (VIN) to the positive terminal of the power supply. Ensure the input voltage is within the specified range (4.5V to 40V).
- Output Connection: Connect the output voltage (VOUT) to the load. The output voltage is fixed at 3.3V.
- Ground Connection: Ensure a common ground connection between the input, output, and load.
- Heat Dissipation: The PS2571-1-A can dissipate heat through its package. For high current applications, consider using a heatsink or ensuring adequate airflow.
- Capacitors: Use input and output capacitors as recommended by the datasheet to stabilize the circuit and reduce ripple. Typically, a 10渭F ceramic capacitor on the input and a 10渭F ceramic capacitor on the output are sufficient.
- PCB Layout: Follow good PCB layout practices to minimize noise and ensure stable operation. Keep traces short and wide, especially for the ground and power lines.
- Storage and Handling: Store the device in a dry, cool environment. Handle with care to avoid static damage.
- Operating Temperature: Ensure the operating temperature remains within the specified range (-40掳C to 125掳C). Exceeding these limits can lead to reduced performance or failure.
- Testing: Before deploying the device in a final application, test it under various conditions to ensure it meets the required specifications.
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