Details

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BUY HCPL-7520-000E https://www.utsource.net/itm/p/9517164.html

Parameter	Symbol	Min	Typ	Max	Unit	Conditions
Forward Voltage	VF	-	1.2	1.6	V	IF = 20 mA, TA = 25掳C
Reverse Breakdown Voltage	VBR	5.0	-	7.0	V	IR = 10 渭A, TA = 25掳C
Output Current	IC	-	15	30	mA	VCE = 5 V, TA = 25掳C
Collector-Emitter Voltage	VCE(max)	-	-	40	V	IC = 30 mA, TA = 25掳C
Isolation Voltage	VIORM	2.5	-	5.0	kV	1 minute, 50/60 Hz
Propagation Delay Time	tPLH, tPHL	-	1.0	1.5	渭s	IF = 20 mA, VCE = 5 V, RL = 500 惟, TA = 25掳C
CTR (Current Transfer Ratio)	CTR	100	200	400	%	IF = 20 mA, IC = 15 mA, VCE = 5 V, TA = 25掳C
Operating Temperature	TOP	-40	-	105	掳C	-
Storage Temperature	TSTG	-55	-	150	掳C	-

Instructions for Use:

1. Power Supply:

   • Ensure that the forward voltage (V_F) is within the specified range to avoid damage to the device.
   • The reverse breakdown voltage (V_BR) should not be exceeded to prevent failure.

2. Current Handling:

   • The output current (I_C) should not exceed the maximum rating to ensure reliable operation.
   • The collector-emitter voltage (V_CE) should be kept below the maximum value to avoid breakdown.

3. Isolation:

   • The isolation voltage (VIORM) specifies the maximum voltage that can be safely applied between the input and output sides of the optocoupler.

4. Timing:

   • The propagation delay time (t_PLH, t_PHL) indicates the time it takes for the output to respond to changes in the input signal.

5. Temperature:

   • Operate the device within the specified operating temperature range (T_OP) to ensure reliable performance.
   • Store the device within the storage temperature range (T_STG) to prevent damage.

6. CTR (Current Transfer Ratio):

   • The CTR is a measure of the efficiency of the optocoupler. Ensure that the input current (I_F) and output current (I_C) are within the specified range for optimal performance.

7. Mounting:

   • Mount the device on a suitable PCB with appropriate soldering techniques to ensure good electrical and thermal connections.

8. Handling:

   • Handle the device with care to avoid mechanical stress or damage. Use ESD protection when handling to prevent electrostatic discharge damage.

9. Testing:

   • Before integrating the device into a circuit, perform initial tests to verify its parameters and functionality.

10. Compliance:

    • Ensure that the device complies with all relevant safety and regulatory standards for your application.

(For reference only)